beret9987

Well, my TRUE is getting shipped out to him and should be there by the end of the week! Maybe the air cooling fun begin!

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Wahkee

how does the tim your planning on using compare to MX-2?

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-Wahkee

ljason8eg

Thanks bro! Couldn't do it without you buddy!

It's a couple C better under load.

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redalert

I thought I would post a pic before I shipped it out

Attached Thumbnails

 

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ljason8eg

Very nice!

Looking forward to getting it.

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IntelConvert

i got teh dark knight and im happy about it, i want to see how it does vs the more expensive coolers.

and the diff in CPU paste. and really, the application of the CPU paste can make just as big of a diff as the paste itself can.

ljason8eg

I'm going to be using IC7, using the dot method. For the Xig, however, i'm going to test which method is best, as some people say that those 2 lines work better, but I think all that'll cause is air bubbles where the lines meet. We shall see.

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IntelConvert

i filled the grooves from the HDT style cooler with thermal paste, then i used the 2 line method. i saw a guide on different kinds of TIM application and either an "X" pattern or 2 lines had the best coverage.

ljason8eg

Yeah it might cover better, but i'm thinking it will create an air pocket where the 2 lines of pastes meet, especially with a thick paste like IC7.

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IntelConvert

the AS5 application instructions say that u can twist the HSF 1 or 2 degrees after it is installed and this will minimize teh air bubbles.

that may help, but depending on the mounting type, it may not be possible to move the HSF at all. i know that after i put my xiggy on, using the backplate behind the board, i couldnt rip that thing off if i tried. my temps are fine and i used the 2 lines. the dot method left some space not covered in the corners in the review i saw, but the corners arent as big of an issue cause the actual chip doesnt extend that far.