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Overclock.net - Overclocking.net > Cooling > Air Cooling | |
Applying thermal compound best & easiest way ?
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LinkBack | Thread Tools |
03-06-09
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#1 (permalink) | ||||||||||
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PC Gamer
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Applying thermal compound best & easiest way ?
I will be installing my hyper 212 tomorrow and have never applied any compound always used stock HSF. Iv'e been reading and so far its been suggested a horizontal line or a small blob in the middle of the cpu the size of a grain of rice? Are these the correct practices?
__________________What is the best way? I don't want to have to remount would like to get it working the first time.
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03-06-09
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4.0ghz
 
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Quote:
http://www.arcticsilver.com/pdf/appi..._quad_wcap.pdf
__________________
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03-06-09
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#3 (permalink) | ||||||||||||
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Overclocker
 
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it depends on which kind of compound you're using.. if using AS5 then do what he said ^^
__________________
E8400 E0 18hr Orthos Blend @ 4005mhz "Buy the Ticket, Take the Ride" Quote:
GA-EP35-DS3L + E8400 ->4.23ghz GA-G31M-S2L + E2180 ->3.15Ghz
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03-06-09
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4.104GHz
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A small dab for dual cores, a line for quads, or stenciling for anything.
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03-06-09
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#5 (permalink) | |||||||||||||
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Blunted
 
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Yep, it really depends on what type of TIM you are using. The stickier stuff I usually spread out a bit before mounting the HSF. The thinner stuff I do a glob in the middle of the CPU and let the pressure do the work.
__________________
Add me on Steam! the_sellout
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