Quote:
Originally Posted by Lord Xeb
Okay, I use IC7 all the time when I can get it. This is what I have found out:
1. You NEED to run it under hot water for about 2-3 minutes so it is easier to get out of the tube.
2. You cannot spread it, so you have to put a glob in the dead center of your CPU.
I recommend using a 6-7mm glob for people using a HDT cooler like the s1283 and for everyone else, use a 5-6mm glob.
3. Take heat sinks and put it down onto the processor and apply some pressure. Then twist side to side a few times try not to lift the cooler up (air pockets are really bad with IC7).
Optional Step 4. Turn your computer on (the mobo out side of the case with all the essentials plugged in like power, GPU, and the power button) and let it get a warm without the fan on the cooler (if you cannot do this then leave it on but do not plug in the fan) (about 2-3 minutes BUT NO MORE THAN 5 MINUTES!!!!!!!!!!!) then twist side to side 2-3 times (this spreads it even more).
5. Tighten down the heat sink. And put the fan back on the heat sink.
6. Turn your computer on and really stress it hard for 2 hours (Intel Burn Test or OCCT LinPack) to break in the compound since it has a 2 hour cure time.
7. Enjoy.
That is what I have come up with after trying to get cooler temps with reseating.
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Great explanation man, +1 for this for sure.
CPU Phenom II X4 940BE @ 3.6GHz [1.408V] |
Motherboard GIGABYTE GA-MA78G-DS3HP Rev 2.0 |
Memory G. Skill 4GB DDR2 |
Graphics Card XFX HD4870 1GB |
Hard Drive Seagate Barracuda 7200.10 500GB Hitachi 250GB |
Power Supply Corsair HX520 |
Case Cooler Master HAF 932 |
CPU cooling Megatron w/ Panaflo H1 |
GPU cooling Accelero S1 Rev 2 + Cooler Master 120mm fan |
OS Vista Ultimate sp2 x64 |
Monitor Samsung Syncmaster 2233sw |