FX55 CABCE 0516WPMW @3705MHz [BH5@283MHz 1.5-2-2-0 / Spi1M@24.719s] - Overclock.net

before · 02-01-06

I would like to share my results with the forums

IHS Mod

Because of very high temps, I've modded the IHS by removing the manufacturer original thermal compound and replacing it with Artic Silver 5. This mod drops 10 to 15°C in full load

SYSTEM

Code:

FX-55 CABCE 0516WPMW core #484
DFI nF4 Ultra-D {501-2fix | 623-1 | 623-2 | 704-2BTA}
2*512 TCCD 507 | 2*256 BH5
1*Gb X800XL
Antec True Power 2.0 550W
Win XP Pro SP2 | Win 2k3

COOLING

Code:

Watercooling:
Pump Atman A-103 (1200l - 1.2m)
Radiator from Air-Conditioning {+ a Radiator BIX}
Homemade waterblock

Liquid chilling:
Compressor 1/4HP
Pecomark condenser 
HX tube inside tube 
Refrigerant: R402A
Evap temp: -20°C

Cascade:
2 * Rotary Compressors 1HP
First stage refrigerant: R290
Second stage refrigerant: R170
Evap temp: -98.5°C unloaded

OVERCLOCKING RESULTS

1) CPU Max Screen = 3705MHz@1.68V

2) CPU Max Stable = not yet

3) 3DMark01 SE

34658pts | 3205MHz @1.65V Chiller | BH5 267MHz 1.5-2-2-0 @3.7V | X800XL 450/590MHz | http://service.futuremark.com/compare?2k1=8930228

32551pts | 3031MHz @1.55V Watercooled | TCCD 303MHz 2.5-4-3-5 @2.8V | X800XL 410/555MHz

31884pts | 3001MHz @1.52V Watercooled | BH5 273MHz 2-2-2-5 @3.7V | X800XL 410/555MHz | http://service.futuremark.com/compare?2k1=8852131

30464pts | 3001MHz @1.46V Watercooled | TCCD 300MHz 2.5-4-3-7 @2.7V | X800XL untweaked | http://service.futuremark.com/compare?2k1=8847589

25990pts CPU Watercooled & TCCD at stock freqs | X800XL untweaked | http://service.futuremark.com/compare?2k1=8843244

4) Super PI 1M

24.234 | 3432MHz @1.65V Cascade controled temp | BH5 @264MHz 1.5-2-2-0 @3.7V

24.719 | 3414MHz @1.70V Cascade controled temp | BH5 @263MHz 1.5-2-2-0 @3.7V

25.375 | 3251MHz @1.55V Chiller | BH5 @271MHz 1.5-2-2-0 @3.7V

25.968 | 3138MHz @1.42V chilled C2H5OH | BH5 @261MHz 1.5-2-2-0 @3.7V

26.188 | 3133MHz @1.42V chilled C2H5OH | BH5 @261MHz 1.5-2-2-5 @3.7V

26.422s | 3113MHz @1.55V Chilled C2H5OH | BH5 283MHz 2-2-2-5 @3.7V

26.594s | 3082MHz @1.50V Watercooled | BH5 280MHz 2-2-2-5 @3.7V

26.609s | 3101MHz @1.52V Watercooled | BH5 282MHz 2-2-2-5 @3.7V

27.094s | 3080MHz @1.50V Watercooled | TCCD 308MHz 2.5-4-3-7 @2.7V

27.203s | 3050MHz @1.50V Watercooled | TCCD @305MHz 2.5-4-3-5 @2.9V

28.610s | 2944MHz @1.50V Watercooled | TCCD @310MHz 2.5-4-3-5 @2.8V

31.922s | 2612MHz @1.15V Watercooled | BH5 @201MHz 1.5-2-2-5 @2.7V

32.844s | 2405MHz @1.46V Watercooled | BH5 @267MHz 1.5-2-2-5 @3.7V

33.109s | 2405MHz @1.42V Watercooled | BH5 @267MHz 1.5-2-2-4 @3.7V

33.172s | 2406MHz @1.42V Watercooled | BH5 @267MHz 1.5-2-2-5 @3.7V

36.860s | 2156MHz @1.50V Watercooled | TCCD @308MHz 2.5-4-3-5 @2.8V

5) CPU-Z

3705MHz@1.68V Cascade CPU@-61°C

3517MHz @ 1.70V chiller CPU@11°C |http://valid.x86-secret.com/show_oc?id=79603

3439MHz @1.63V Chilled C2H5OH CPU@20°C | http://valid.x86-secret.com/show_oc?id=71814

3420MHz @1.55V Chilled C2H5OH CPU@11°C | http://valid.x86-secret.com/show_oc?id=70973

3300MHz @1.63V Watercooled | http://valid.x86-secret.com/show_oc.php?id=61962

3252MHz @1.50V Watercooled | http://valid.x86-secret.com/show_oc.php?id=61955

6) PiFast 4.3 10M

28.26 | 3133MHz @1.42V chilled C2H5OH | BH5 @261MHz 1.5-2-2-0 @3.7V

28.83 | 3139MHz @1.42V chilled C2H5OH | BH5 @241MHz 1.5-2-2-5 @3.7V

7) OCCT

3000MHz @1.39V Chilled C2H5OH

xie67 · 02-01-06

I can tell you what. Some nice steady hands on removing the lid off that FX-55 hey ?

some nice results there..

cheers..

and be happy not mad !

**bigvaL** · 02-01-06

Awesome work man, how come you just didnt leave the IHS off altogether? You couldve had even better temps without it. Nice job on the ocing!

brad62249 · 02-01-06

Quote:

Originally Posted by bigval

Awesome work man, how come you just didnt leave the IHS off altogether? You couldve had even better temps without it. Nice job on the ocing!

I was just thinking the same thing.....

thinking that the IHS would actuall hold in a little heat...as with out it like on the older AMD chips that having a little air being able to flow slightly around the chip and having direct contact with the heatsink would allow for better cooling...

iker0 · 02-01-06

wht did you use to stick the IHS back on?

before · 02-01-06

Quote:

Originally Posted by xie67

I can tell you what. Some nice steady hands on removing the lid off that FX-55 hey ?

some nice results there..

cheers..

and be happy not mad !

Thx mate!

Quote:

Originally Posted by bigval

Awesome work man, how come you just didnt leave the IHS off altogether? You couldve had even better temps without it. Nice job on the ocing!

Quote:

Originally Posted by brad62249

I was just thinking the same thing.....

thinking that the IHS would actuall hold in a little heat...as with out it like on the older AMD chips that having a little air being able to flow slightly around the chip and having direct contact with the heatsink would allow for better cooling...

In fact, the improvement of leaving the IHS off in comparison to sticking it back on isn't sufficiently significant to justify the risk of broking the core while it's naked. What causes the high temps isn't really the copper IHS but mostly the manufacturer thermal compound... if you substitute it with AS, or something equivalent (I'm also considering using liquid metal; but I really don't like it...), chances are high that you'll never experience a significant difference between this mod and the simple IHS removal.
Anyway, I'm using some kind of non-traditional cooling such as homemade waterblocks and thus I need to preserve safety.

Check this figure for temps differencies between stock IHS+thermal compound and IHS+AS Ceramic (with Air cooling):

Quote:

Originally Posted by iker0

wht did you use to stick the IHS back on?

In order to stick back on the IHS, I've used some kind of silicon usually used to make joins of sealing into engines. Actual on is called Loctite Autojoin.