Skylake Delidded - Page 49 - Overclock.net

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post #481 of 822 Old 10-04-2015, 12:05 PM
 
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Quote:
Originally Posted by mnasir View Post

10 to 20 degrees is still quite a bit. You might want to try Lapping.

Sincerely,

Nasir

I'm quite happy with this temperature drop, I was not complaining. my realbench have 20 degree difference. Delidding sounds like a great investment granted that you don't destroy your cpu in the process.

Lapping seems like low risk, low benefit, lots of work sanding haha. I might try it later but for a few degrees it is on the bottom of the list.
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post #482 of 822 Old 10-07-2015, 08:58 AM
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Originally Posted by der8auer View Post

Like I said before it's not the mounting height or the mounting pressure which is the problem. The PCB is so thin that the corners won't have contact to the pins in the socket. No matter how much pressure you apply to the middle of the chip.
Sorry for the ot but I have to ask...
what about devil's canyon ? is it worth to go direct die cooling ? I have the Ek kit at home and I'm using high end custom watercooling.
(btw when I used direct-die last time on my prevous chip, im the EK manual they say screw the screws to the end, but I found it very hard to do and I was sooo worried about the chips if it cracks or not. Any ideas?)

CPU: Intel i7 4790K @5.1Ghz MB: Asus Maximus VII Formula RAM: 4x4GB Corsair Dominator Platinum 2666CL10 VGA: Nvidia GTX 1080 FE 2.2GHz SDD: 2x Samsung 840 PRO 256GB(RAID0) + Samsung 850 EVO 500GB PSU: SuperFlower Leadex Platinum 1200W MON: Asus Swift PG278Q 27" (CPU bought from: https://siliconlottery.com/)
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post #483 of 822 Old 10-07-2015, 09:01 AM
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Quote:
Originally Posted by fat4l View Post

Sorry for the ot but I have to ask...
what about devil's canyon ? is it worth to go direct die cooling ? I have the Ek kit at home and I'm using high end custom watercooling.
(btw when I used direct-die last time on my prevous chip, im the EK manual they say screw the screws to the end, but I found it very hard to do and I was sooo worried about the chips if it cracks or not. Any ideas?)

You can usually gain around 5-8°C comparing direct-die vs normal delid.
The required mounting pressure should be a lot lower for direct die mount because of the small contact area.
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post #484 of 822 Old 10-07-2015, 12:06 PM
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Quote:
Originally Posted by der8auer View Post

You can usually gain around 5-8°C comparing direct-die vs normal delid.
The required mounting pressure should be a lot lower for direct die mount because of the small contact area.
ok thanks!
I will go for it.
Hopefully I won't break my golden chip lol biggrin.gif

CPU: Intel i7 4790K @5.1Ghz MB: Asus Maximus VII Formula RAM: 4x4GB Corsair Dominator Platinum 2666CL10 VGA: Nvidia GTX 1080 FE 2.2GHz SDD: 2x Samsung 840 PRO 256GB(RAID0) + Samsung 850 EVO 500GB PSU: SuperFlower Leadex Platinum 1200W MON: Asus Swift PG278Q 27" (CPU bought from: https://siliconlottery.com/)
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post #485 of 822 Old 10-19-2015, 05:47 AM
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Ok so direct die done on my 4790k.
The difference is very small, 2-3C.
Before I was using CLP on the core + CLP on the IHS.
Now it's CLP on the core.
thumb.gif

CPU: Intel i7 4790K @5.1Ghz MB: Asus Maximus VII Formula RAM: 4x4GB Corsair Dominator Platinum 2666CL10 VGA: Nvidia GTX 1080 FE 2.2GHz SDD: 2x Samsung 840 PRO 256GB(RAID0) + Samsung 850 EVO 500GB PSU: SuperFlower Leadex Platinum 1200W MON: Asus Swift PG278Q 27" (CPU bought from: https://siliconlottery.com/)
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post #486 of 822 Old 10-19-2015, 06:38 PM
 
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Quote:
Originally Posted by fat4l View Post

Ok so direct die done on my 4790k.
The difference is very small, 2-3C.
Before I was using CLP on the core + CLP on the IHS.
Now it's CLP on the core.
thumb.gif

Direct die, thats very brave fat4l. 2-3°c is not so good. You'd think it would be a lot more on a direct mount, Any how, you have a nice standard delid which is safer and just as good as direct on that absolute golden chip of yours, fantastic either way. thumb.gif

Topped 4790k 4.8Ghz 1.245v/4500Mhz 1.215v
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post #487 of 822 Old 10-19-2015, 09:54 PM
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This on a bare die for the win - with the 4770 I "balanced" the IHS on the die since the die was taller, but the IHS was not resealed onto the PCB.

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post #488 of 822 Old 10-20-2015, 08:38 PM
 
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So is the consensus now to use the vice+heat, vice+hammer, kevlar, or razor method? (or others?)
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post #489 of 822 Old 10-21-2015, 12:57 AM
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Well I used cl pro as I find it to be better.
Personal preference I guess.
Temps wise, it's the same as cl ultra.

CPU: Intel i7 4790K @5.1Ghz MB: Asus Maximus VII Formula RAM: 4x4GB Corsair Dominator Platinum 2666CL10 VGA: Nvidia GTX 1080 FE 2.2GHz SDD: 2x Samsung 840 PRO 256GB(RAID0) + Samsung 850 EVO 500GB PSU: SuperFlower Leadex Platinum 1200W MON: Asus Swift PG278Q 27" (CPU bought from: https://siliconlottery.com/)
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post #490 of 822 Old 10-21-2015, 10:08 AM
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OK cool I have never had cl pro but it seems lots of people use it very successfully.
So you delidded a 4790K? what temp delta did you get? I have one but only dellidded my 4770K.
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