The line method being the one that the AS5 people recommend for use on a C2D type CPU. HMMMMM..... Good question.
I think that unless the thermal compound that you are using shows an alternative method for application, then the answer would be, YES!
Edit...... with the qualifier added that the thermal compound that you are using must spread out over the heat spreader the same way that AS5 does. So that would mean that it is of a similar consistency.
This is an older thread, you may not receive a response, and could be reviving an old thread. Please consider creating a new thread.
Related Threads
?
?
?
?
?
Ask a question
Ask a question
Overclock.net
27.8M posts
541.2K members
Since 2004
A forum community dedicated to overclocking enthusiasts and testing the limits of computing. Come join the discussion about computing, builds, collections, displays, models, styles, scales, specifications, reviews, accessories, classifieds, and more!