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Posts by Sam OCX

Binning B-die is indeed hard. After nearly 50 sticks and 10 RMAs I'm yet to find a pair that can do CW at 2000+. That said, I'm not sure if ES is better than retail. I have some Corsair sticks with my name on/in them, I have some G.Skill ES sticks (which have a different PCB from retail, by the way) and all of them are worse than the best retails I bought myself (which is also why I have recently been hiding the SPD tabs, not to give the vendors any credit). Which makes it...
Coming back to VTTDDR, I've spent a few days playing with my B-die and on some kits it plays quite a big role. Some nasty kits will only be stable with specific, often illogical combinations of VTTDDR and Vmem (e.g. 1.80/0.80, 1.85/0.85 and 1.90/0.80 works, but 1.80/0.85, 1.85/0.80, 1.90/0.85 does not). Some other kits (like my special Corsair) do not like when VTTDDR is above a certain fixed value. Some other kits (like my best Tridents) do not like when the ratio between...
I had September-made (week 1537) 3466C16, they were D-die. I think G.Skill have started using E-die from week 1538+, depending on the model.
Tested the 2800C14 Savage the other day. The MHz/volt quality is very good, but handling of the kit is a nightmare. No idea why, but I get lots of random 55-codes at POST on both ASUS and MSI.
I am a little bit skeptical about 1.2V part of the spec. If it turns out to be true, then the sticks should be comparable in terms of IC quality / overclockability to stuff you get on 3333C16 and higher rated kits. Otherwise (case: 1.35V) it's a rather average bin that should be priced accordingly.
Geil White Dragon a bit late to the party. Sad, these are quite good MFR for just 70€ a pair.
Tested two Klevv 2400C11 kits as of late: the Urbane... ...and the Genuine... From my brief experience, it seems that all of Klevv's DDR3 Neo and Urbane kits have similar chip quality irrespective of the bin. The Genuine seem a lot better, but also a lot more expensive. These are my last tests on DDR3. Just two weeks after narrowing all my DDR3 testing hardware down to one CPU and one board, both of them have gone belly up while running HCI Memtest on...
Given what D-die and E-die can/cannot do, I would not ever expect E-die on anything below 3866C19 spec-wise.
Some more results from Samsung E-die. 1800MHz CL10 boots but would need more than 2.20V (which is max of what I can set).
There is also a 2x16GB version announced and no 2x4GB version present. This gives a strong hint that Geil are using (or were planning to use) 8Gbit memory chips on both 2x8GB (single-sided) and 2x16GB (dual-sided) versions.
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