kevindd992002

@Lord Xeb

I have the MegaShadow and Shin Etsu X23-7783D, do I still need to do the twisting? And how about the turning on the computer without pluuging in the HSF fan, is that really necessary?

I don't understand steps 3 and 4 much.

In step 3, is the heatsink not yet MOUNTED by its mechanism? How will you apply 25-40 pounds without the heatsink being mounted?

And in step 4, is it STILL not yet mounted while burning the CPU for 3 minutes?

DarkstarX10a

I dont imagine so, but it helps spread it out. Been thinking of switching to either IC7 or OCZ Freeze from my usual handy dandy AS paste.

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Gr33n Machine

T3h_Ch33z_Muncha

i know this post is a little old, but i just wanted to say that HDT coolers are designed with those gaps for a reason - to optimise the amount of TIM on the cooler. Excess TIM is flushed into the gaps by the pressure, leaving only the necessary amount of TIM on the CPU.

edit: FYI you are never supposed to touch an IHS, heatsink base or TIM with your finger. Oils adversely effect temps.

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Please don't call me Muncha, as cheese is not the only insinuatable munchable object; Ch33z will suffice. Oh, and i almost forgot to express my love for Heru
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Lord Xeb

Re read the guide, I just fix it.

For your heat sink, I would do step 1-2 (and make sure the mounting hardware is read for your heat sink or on your heat sink!)

Then put your heat sink down and tighten it.

After that, turn on your computer and let it burn your processor with LinX, Intel burn Test, or OCCT Linpack, for about 10 minutes or so (it should really get your processor hot and spread the thermal compound). Then your done!

The mega is a such a HUGE heat sink it is impossible to twist without lifting the thing

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kevindd992002

Thanks

What do you mean by "(and make sure the mounting hardware is read for your heat sink or on your heat sink!)" ?? My mounting hardware is read for my heatsink? Sorry for asking.

Lord Xeb

Sorry, make sure your mounting hardware is ready for your heat sink or it is on your heat sink ready to mount

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kevindd992002

Oh ok, no prob. So the mounting hardware would be the one responsible for giving the 2-5 pounds of pressure you were talking about?

And should I screw in the mounting hardware one edge at a time or all edges at the same time?

Also, should I use the line method instead of the glob method in the center since I have a Quad Core CPU? I've heard that the dot method is for dual cores and the line method is for the quad core. I may be wrong though.

Lastly, regarding the application in NB and SB chipsets, how many mm of glob would you recommend I put?

Lord Xeb

When you screw it in, you do it like this:

1....3
4....2

That way it is even pressure as you put it on. You want to make sure that is figure tight first.

As for the NB, put about a 1-2mm glob on (or enough to spread evenly over the entire chip. You could do even a 3mm glob if you wanted to). The SB I would do a 3mm glob.

Personally I do not do the line method as thick TIMs are really hard to do that with. You could do it that way though but I personally do not recommend it

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Clockadile Dundee

Here is my roughly line-shaped application of IC7 to an i7 920.
Latest 24/7 OC = 4.4GHz HT Enabled (210MHz*21x), 1.45625v vCore, hottest core max @ 100% load (LinX) = 68c.

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Lord Xeb

The Core i7 is a far bigger chip and would take around a 7-8mm may even a 9mm glob! I think if you made the line just a tad thicker it would be better but I have never used a Core i7 before so I wouldn't know about it....

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