EmerilLIVE

I don't have an electrical engineering degree or anything like that, but I'd think something that processes stuff "out-of-order" is going to have an out-of-order die, that would only make sense.

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Spart

LOL. Good point.

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arkheii

Hooray for competition!

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Chosen

If i remember correctly 2 L1 caches = dualcore?

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The L1 cache can be in multiple physical places. Each core on most multicore chips do have their own L1 cache though, but these are different logical caches so to speak, they could technically occupy the same physical area.

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xlink

maybe...

just maybe

each section labeled contains two pairs of functional units and half is dedicated to one core and half to the other...

it's technically possible

ENTERPRISE

This is good. I have wanted to see VIA com out and start developing some more desktop orientated CPU's. I think they could really prove themselves here.

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Outcasst

Just looking at those pics it's incredible how much stuff they can fit in

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foolsgold

Agreed. This could definitely put some pressure on AMD and Intel if it does well (which is what preliminary benchmarks have shown.)

What I'm most curious to see is what relationship VIA will have with nVidia going forward. AMD already has ATI in the pocket, Intel is developing Larrabee, and nVidia is providing a chipset for the new VIA product--potential merger going forward? If that's the direction of the market, it might make sense, but it's too early to tell without seeing how Isaiah performs and seeing if VIA can get a good foothold in the mainstream CPU market.

bowman

The die shot is from the Isaiah, a single-core CPU. The talk of dual-core is a planned future design which will incorporate two Isaiah cores.

It will obviously perform better than the Atom but they target different markets. They have a little overlap in the target applications but the Atom is much smaller, requires less power and generates less heat. The Atom will be seen in the next iPhone - can't say that for this. For 'Eee' size laptops it will probably be just the ticket.

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