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Overclock.net - Overclocking.net > Industry News > Hardware News | |
[bcchardware]Arctic Cooling MX-3 Thermal Compound
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#1 (permalink) | |||||||||||
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Case Modder
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Appears to beat AS5 and its predecessor, MX-2. Hopefully on the next MX-3 review we'll see some IC7 Diamond, Shin Etsu and OCZ Freeze.
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#2 (permalink) | |||||||||||||
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Danke schön
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Well, Freeze & MX-2 were supposed to be better than AS5, but equal to one another.
Either way, it doesn't really look like it matters what paste you pick up. As long as it's MX-3, Freeze, Shin Etsu, or IC Diamond, you'll be just fine.
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#3 (permalink) | |||||||||||||
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Another World
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This is one heck of a paste. I'm definitely picking this up when my MX-2 runs out. Wonder when it'll be available.
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#4 (permalink) | ||||||||||||||
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PC Gamer
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MX-3 appears to be pretty good,but I have to question the MX-2 and AS5 having the same results,on my system MX-2 was better by 4 degress
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#5 (permalink) | ||||||||||
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Case Modder
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Yeah, I'm also a bit skeptical of the site as I've never heard of it but if it's actually better than MX-2(I'd expect it to be) then it must be pretty good.
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#6 (permalink) | ||||||||||||
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Programmer
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I wonder how the results would be on a HS that has been lapped to a mirror-like shine, sitting on a heatspreader that has also been lapped to a mirror-like shine?
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#7 (permalink) | |||||||||||||
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4387 point(s) total
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TIM would have an even less effect and performance would be very very close.
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#8 (permalink) | |||||||||||||
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Your AVATAR is my WEAPON!
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Lapping is supposed to make you use less thermal compound therefor reducing the differences in paste
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#9 (permalink) | |||||||||||||
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Intel Overclocker
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Might consider this for a later build, but when will that be?
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#10 (permalink) | |||||||||||||
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The Dapper Swindler
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![]() Anybody else find this picture hilarious?
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