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Old 08-23-07   #1 (permalink)
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Default E6600 heat issue
Hey just wanted to say hello to everybody on the forum.

I am having a heat issue with my chip according to what I have been reading on the site compared to others. I am running a Zalman CNP 9500 on my E6600 chip. My core temps according to core temp are 50 to 60. I have my computer at 1.43 core voltage right now.

I took the heatsink off earlier to check out the compound pattern. It seems like when scraping the paste off of the chip, that it was concave toward the center slightly. Do they make the chip that way while assuming your heatsink will have enough pressure to flatten it?

While attaching my zalman back I noticed that it does not rest very tightly on the chip. I have all of the bolts snug.

I was thinking about lapping the chip, to try to help. Any ideas people?
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Old 08-23-07   #2 (permalink)
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I'd say go for it, lapping does void the warranty though. I'm not brave enough yet, plus I have no need seeing as where I'm at with my OC. But yea, try re-seating a few times, try a few different AS5 application methods to see what works best for you.
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Old 08-23-07   #3 (permalink)
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Welcome to Overclock.net!

What is your T-junction temp in CoreTemp? If it is 85C, you are fine. If it is 100C, subtract 15C off of your every read of CoreTemp's temp.

50C ~ 60C is your idle ~ load temp?

The concave thing you saw on your Zalman is not good. Flat, flat is good. If you ever start lapping, start with the heat sink because it is cheaper to replace if anything goes wrong.

Beware, lapping voids warranties.
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Old 08-23-07   #4 (permalink)
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Is your board warped? did you use correct amount of as5, and reseat. Also insure air flow pattern is sufficient.
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Old 08-23-07   #5 (permalink)
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Originally Posted by TaiDinh View Post
Welcome to Overclock.net!

What is your T-junction temp in CoreTemp? If it is 85C, you are fine. If it is 100C, subtract 15C off of your every read of CoreTemp's temp.

50C ~ 60C is your idle ~ load temp?

The concave thing you saw on your Zalman is not good. Flat, flat is good. If you ever start lapping, start with the heat sink because it is cheaper to replace if anything goes wrong.

Beware, lapping voids warranties.
It is 85c in on the T junction. What is that reading? Also It is not the zalman that is not flat, but my chip surface.
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Old 08-23-07   #6 (permalink)
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Is your board warped? did you use correct amount of as5, and reseat. Also insure air flow pattern is sufficient.
I dont believe that my board is warped. I put down maybe about a bb size dab, and spread it with credit card. I had some excess on the credit card after getting a smooth coat.
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Old 08-23-07   #7 (permalink)
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I'd say go for it, lapping does void the warranty though. I'm not brave enough yet, plus I have no need seeing as where I'm at with my OC. But yea, try re-seating a few times, try a few different AS5 application methods to see what works best for you.
what are the different methods BTW?
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Old 08-23-07   #8 (permalink)
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http://www.arcticsilver.com/pdf/appi..._dual_wcap.pdf
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Old 08-23-07   #9 (permalink)
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thanks I just got done reading that. It seems they did not have those instructions for my chip back when it was new. (the thin line is what I am referring to)
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Old 08-23-07   #10 (permalink)
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the thin line method is for dual die chips like the pentium Ds and the q6xxx for the E chips use half a grain of rice sized drop of AS5 and then put the heatsink on.

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