Description:
The first ever CPU heatsink to utilize vertical vapor chamber cooling and combine it with heat pipe technology, TPC 812 is prepared to handle the massive heat generated by overclocking and benchmarking. Vertical vapor chamber working in tandem with heat pipes and a specialized heatsink and fin design.
This review as of now, soon to be edited, is basically of the first impression. Actual data coming soon!
The box it comes in quickly indicates it to be a large cooler.
First look it looks large. *Hint do not pick up by the fan. While the fan clips are snug enough to hold the fan in place they are not tight enough to lift the cooler by.
Compared to stock intel HSF...
I was in awe by the top of the cooler it looks clean and the heatpipes/vapor chamber tops look shiny, very nice looking.
As I looked down I notice the vapor chambers and how they look like they are straight chambers but seem to be "dented". I highly doubt it was designed that way but possibly so. It also looks like whatever metal plating is on the chambers might flake off but that is to be seen.
I was disappointed by this as these vapor chambers are a huge selling point for this cooler. I have to wonder if the chambers are pinched together inside and if they are indeed going to allow the hot vapor to rise. :shrug:
It comes packed in a white box all the hardware for all current generation sockets 2011,1155,1156,775,FM1,AM3+,AM3, and AM2. It also uses a backplate so you will need access to rear of motherboard for installation.
Thats all for now check back later after I run some benches and test it against intel stock cooler on 1155 socket.
Pros
Cons
Cooler Master, Mounts on all current platforms,
Vapor chambers dont seem of quality construction,
Ratings
Overall
3
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