Intel BXSTS100C Passive/active combination heat sink with removable fan
Description:
Type: Fan & Heatsinks Compatibility: LGA 1366 Features: Maximum CPU TDP: 130W With fan installed: - Pedestal chassis that provides adequate ventilation and correct temperature air to heat sink With fan removed: - Pedestal chassis with ducted airflow to heat sink - 2U or larger rack chassis with ducted airflow to heat sink Parts: 1 year limited Labor: 1 year limited
Description:
Type: Fan & Heatsinks Compatibility: LGA 1366 Features: Maximum CPU TDP: 130W With fan installed: - Pedestal chassis that provides adequate ventilation and correct temperature air to heat sink With fan removed: - Pedestal chassis with ducted airflow to heat sink - 2U or larger rack chassis with ducted airflow to heat sink Parts: 1 year limited Labor: 1 year limited