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Is something wrong with my Hyper 212+ TIM application? - Page 2

post #11 of 24
i use a credit card to fill in the gaps, then a 1/2 pea sized dot on the cpu when installing it
post #12 of 24
Quote:
Originally Posted by alpsie View Post
but if you just do that soaceballsrules, wont air get cought in the small gaps.
There are no gaps. The TIM will spread and fill the gaps on its own. No air pockets.
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post #13 of 24
Yea, the "credit card method" gets to me lol, great chance of traping air in the TIM as you "knead" it into the crack's. When I installed my CM212+ I use every method I could find, 3 line, rice grain,pea grain,x in center, credit card method, you name it. what worked best for me was 3 slightly smaller than rice size(less is more with TIM) line's on the base plate(inbetween the heat pipe's). the pressure from installing the cooler filled all the gaps just fine for me.
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post #14 of 24
I used the line method and then just used a plastic bag for a finger condom to spread it around. With a OC at 4.5 1.26v it is 58c under load with prime 95
post #15 of 24
i have always did the line method for HDT heatsinks and have always had great results. I do very thin lines on each pipe.
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post #16 of 24
Thread Starter 
Thanks alot guys and I'll keep most of your suggestions in mind.
I spread it with my finger even with a bag over it.

What I need to actually solve it is if you guys can be a little more descriptive.
"Small" "Large", we all have different perspectives on sizes and I think it'll make it easier for me if you guys can say it in cm or in or whatever.

Gonna +rep everyone and THANKS!
    
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post #17 of 24
I am idling at 34c-37c with my brand new sandy build on a dark knight cpu cooler. I used artic silver 5
    
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post #18 of 24
Thread Starter 
Quote:
Originally Posted by bstover17 View Post
I am idling at 34c-37c with my brand new sandy build on a dark knight cpu cooler. I used AC7
    
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post #19 of 24
Medium sized, about a cm.

Put the 212+ on... without brackets..

Now spin it in a circle.
Works for me.

LOL.
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post #20 of 24
Quote:
Originally Posted by Shomiyamu! View Post
Thanks alot guys and I'll keep most of your suggestions in mind.
I spread it with my finger even with a bag over it.

What I need to actually solve it is if you guys can be a little more descriptive.
"Small" "Large", we all have different perspectives on sizes and I think it'll make it easier for me if you guys can say it in cm or in or whatever.

Gonna +rep everyone and THANKS!
Like i said in my above post..Ive used most all the methods i can find for CM Hyper 212+. What worked best for me was to make 3 smaller than rice grain size line's inbetween the heatsink. DO NOT SPREAD. you will trap air in the TIM as you play with it, reducing its ability to work. aslo if you use to much TIM it wont transfer heat as much as insulate heat to the CPU. But every rig id differnt so your going to have to try out diff paste's.

AS5 is good stuff but takes 200 hours to fully cure, keep that in mind.
I saw the best performance with my above application method w/ ICDiamond7 TIM.
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Gizmoto
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