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would baking fix this? - Page 2

post #11 of 24
Quote:
Originally Posted by philhalo66 View Post
yes, the reason why nvidia cards die is because they are cheap asses and use crap solder so the solder cracks under the GPU and when you bake it it reflows the solder.
Thats not nVidias fault. Thats the 3rd party manufacturers fault who dont know how to use proper BGA soldering techniques. Read up before asshatting out.
    
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post #12 of 24
Thread Starter 
Quote:
Originally Posted by MR KROGOTH View Post
Thats not nVidias fault. Thats the 3rd party manufacturers fault who dont know how to use proper BGA soldering techniques. Read up before asshatting out.
well why does it never happen to ATi/AMD? i hear all over the place on here it only effects nvidia. either way its a perfect example why not to buy nvidia.
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post #13 of 24
Quote:
Originally Posted by philhalo66 View Post
well why does it never happen to ATi/AMD? i hear all over the place on here it only effects nvidia. either way its a perfect example why not to buy nvidia.
Because back during the 8xxx Series, nVidia was using a high-lead solder. It has been fixed with the newer/more reliable Eutectic solder that helps against constant thermal cycling that causes the cracking.

So in all honesty, anything newer than the 8xxx series has the new solder and doesn't have this problem with bump cracking.

EDIT: Let us not forget the artifacting due to thermal issues on the 4890:

http://www.overclock.net/search.php?searchid=4289878
Edited by MR KROGOTH - 5/15/11 at 1:31pm
    
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post #14 of 24
yeah i had a friends that would show crazy colors and artifacts ... even installing drivers was a pita ...

baked it .... solid
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post #15 of 24
Thread Starter 
Quote:
Originally Posted by MR KROGOTH View Post
Because back during the 8xxx Series, nVidia was using a high-lead solder. It has been fixed with the newer/more reliable Eutectic solder that helps against constant thermal cycling that causes the cracking.

So in all honesty, anything newer than the 8xxx series has the new solder and doesn't have this problem with bump cracking.

EDIT: Let us not forget the artifacting due to thermal issues on the 4890:

http://www.overclock.net/search.php?searchid=4289878
i seen like 78 thread on baking the 9800 series, heck even my 9800GX2 needed to be baked a few times lol. and the reason why the 4890's artifacted was the memory overheated.
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post #16 of 24
Quote:
Originally Posted by philhalo66 View Post
i seen like 78 thread on baking the 9800 series, heck even my 9800GX2 needed to be baked a few times lol. and the reason why the 4890's artifacted was the memory overheated.
Which is why there is no such thing as one manufacturer is better than the other.

The 9xxx series was just a naturally hot running architecture. Just like 4xxx series baked themselves into needing to be baked.

I seen like 79 thread on baking 4800 series bro. Heck even my friend 4890 needed to be baked.
    
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post #17 of 24
Quote:
Originally Posted by MR KROGOTH View Post
Because back during the 8xxx Series, nVidia was using a high-lead solder. It has been fixed with the newer/more reliable Eutectic solder that helps against constant thermal cycling that causes the cracking.

So in all honesty, anything newer than the 8xxx series has the new solder and doesn't have this problem with bump cracking.

EDIT: Let us not forget the artifacting due to thermal issues on the 4890:

http://www.overclock.net/search.php?searchid=4289878
You said it wasn't nvidias fault for the cards needing baking. but yet in this statement you make it clear that is was something about the way nvidia designed the cards that brought up the need for baking.
You are contradicting yourself.
post #18 of 24
Thread Starter 
Quote:
Originally Posted by MR KROGOTH View Post
Which is why there is no such thing as one manufacturer is better than the other.

The 9xxx series was just a naturally hot running architecture. Just like 4xxx series baked themselves into needing to be baked.

I seen like 79 thread on baking 4800 series bro. Heck even my friend 4890 needed to be baked.
i never had a problem with my 4870 and i had it for over a year it was hitting 80C lots of times. link me to atleast 1 thread where someone baked their 4800 series card and I'll leave it at that.
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post #19 of 24
Quote:
Originally Posted by thrasherht View Post
You said it wasn't nvidias fault for the cards needing baking. but yet in this statement you make it clear that is was something about the way nvidia designed the cards that brought up the need for baking.
You are contradicting yourself.
I guess I did. It does not matter as the issue has been remedied by the eutectic solder; However the bolding statement is false, it is not the design of the FCBGA chips or GPUs themselves, but rather the unknown facts about the high-lead solder that caused the bump cracking issue.
    
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post #20 of 24
Quote:
Originally Posted by MR KROGOTH View Post
I guess I did. It does not matter as the issue has been remedied by the eutectic solder; However the bolding statement is false, it is not the design of the FCBGA chips or GPUs themselves, but rather the unknown facts about the high-lead solder that caused the bump cracking issue.
Design of a card could include the materials used also, so my statement still stands, if nvidia made that type of solder part of their design.
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