EK just replied to me again. I told them I used the rubber pad this time and sent a picture and they replied with this:
"No, you should not install the rubber pad with the LGA-1366 mount, seriously. The LGA-1366 ILM backplate itself is grounded therefore the EK-Backplate cannot short out anything. Otherwise the POM standoffs aren't doing the job they are supposed to!
Mount the backplate as per instructions and YOU WILL BE FINE!
Should I go through the hassle of removing it? Maybe get better temps on that CPU?
EK replied to me when I was asking if I need remove the mount and take out the pad:
"Yes, please do dissasemble your waterblock and install the backplate according to the manual for LGA-1366 application! The EK-Backplate is NOT touching any electrical component when mounted correctly without the rubber pad thus it is safe to use."
What is your guys take? Should I bother?Edited by Strobe - 6/16/11 at 7:38am