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[Anand] A Quick Look at a 22nm Ivy Bridge Wafer - Page 3

post #21 of 36
Quote:
Originally Posted by corky dorkelson View Post
This chart doesn't confirm P67/Z68 compatibility. All it states is that P67 and Z68 are both "performance" oriented and so is Z77 and Z75. In all likeliness, Z77 or Z75 will be REQUIRED for Ivy Bridge. I hope I am wrong, but the way Intel has been cranking out new sockets, I wouldn't expect to be able to drop Ivy into Sandy.
Never happened with die shrinks, which is what Ivy will be. New chipsets, yes, new sockets no.

Also, this pretty much confirms IB will be a drop-in upgrade to current P67,H67 and Z68 mobos.

Quote:
Some time in the first half of 2012, Intel will release its next generation of desktop processors for the LGA1155 socket, based on the new Ivy Bridge silicon. Ivy Bridge is a 22 nanometer die-shrink of Sandy Bridge, with a few features added/improved.

To begin with, Ivy Bridge processors are seamlessly compatible with existing LGA1155 platforms, and "Cougar Point" P67, H67, H61, Z68, chipsets, although it will come with its own 7-series chipset.

There's the usual PCI-Express 2.0 x16 hub that can drive up to two discrete graphics cards with electrical x8 connections.

Cougar Point, Panther Point chipsets are seamlessly compatible with each other. Ivy Bridge processors can run on existing 6-series chipsets, Sandy Bridge should be able to run on Panther Point 7-series chipsets as well.
The incentive in Panther Point chipset, however, is that it will feature a newer FDI interface that will support up to three displays running simultaneously; and that it will feature an integrated USB 3.0 controller.
All Intel is doing is launch a new chipset to complement the IB line-up.




Original Thread
Edited by PanicProne - 5/31/11 at 1:02pm
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post #22 of 36
Oh, well disregard what I said completely. This is great news.
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post #23 of 36
Quote:
Originally Posted by corky dorkelson View Post
Oh, well disregard what I said completely. This is great news.
Yeah, I don't think a new chipset's been required for any of Intel's die shrinks...can someone back me up?
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post #24 of 36
Quote:
Originally Posted by Emmanuel View Post
I don't understand what all the excitement is about, we're reaching die shrinks that make CPUs less and less overclockable due to being very sensitive to voltage. Here 99% of people don't care about power consumption (except when bashing nVidia) so "higher power efficiency" isn't a valid reason unless it translates into "considerable performance gains".
The 3D Tri-Gate transistors coming with Ivy Bridge should help performance considerably.
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post #25 of 36
Quote:
Originally Posted by Emmanuel View Post
I don't understand what all the excitement is about, we're reaching die shrinks that make CPUs less and less overclockable due to being very sensitive to voltage. Here 99% of people don't care about power consumption (except when bashing nVidia) so "higher power efficiency" isn't a valid reason unless it translates into "considerable performance gains". Just my 2 cents, not against technology advancing but I'm starting to see the end of the overclocking days
Die shrinks do prevent higher voltages to be run through the chips because of electron tunneling, leaks, etc. But you have to keep in mind that this also has to do with the material the chip is made from. Different types of material will change the amount of voltage running through it. So less overclockabilty is not always the case with die shrinks .
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post #26 of 36
Quote:
Originally Posted by flamingoyster View Post
Yeah, I don't think a new chipset's been required for any of Intel's die shrinks...can someone back me up?
I think It was needed when intel went from 65nm to 45nm, but that had more to do with higher FSB clocks IIRC.
Edited by qwertymac93 - 5/31/11 at 3:20pm
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post #27 of 36
Quote:
Originally Posted by AMC View Post
Die shrinks do prevent higher voltages to be run through the chips because of electron tunneling, leaks, etc. But you have to keep in mind that this also has to do with the material the chip is made from. Different types of material will change the amount of voltage running through it. So less overclockabilty is not always the case with die shrinks .




100% true
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post #28 of 36
They be stealin our nanometrez
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post #29 of 36
Quote:
Originally Posted by PoopaScoopa View Post
It's actually going to allow even better OCing due to lower heat output. Just look at what we can do with SB on air: 5.2+Ghz! It also allows for more cores in the same die area.
5.2Ghz if you're lucky enough to get a "good chip" most have only been getting 4.5 out of them.
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post #30 of 36
Quote:
Originally Posted by Andr3az View Post
They be stealin our nanometrez
Lol I knew someone was going to bring that up. Right now the problem we're having is that a lot applications are not multi threaded enough so yeah smaller dies allow for more and more cores, but we need the software to follow that. That's why for now raw frequency remains important, otherwise we should drop the idea of the CPU and use GPUs as CPUs to have hundreds of cores (I know works like that are already underway). I was just judging from an overclocking standpoint, of course if the new CPUs > our current OCed CPUs, we'll move on, just like how we moved from Pentium 4s to Core 2 Duos that were roughly half the speed in GHz. What I'm saying is that it takes the fun away. Anyway one day we're gonna have all major components integrated into one chip and it'll be the end of the fun. Perhaps we'll start enjoying our hardware more instead of benching it all the time lol!
    
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