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[HS] What is the Best Way to Apply Thermal Compound? - Page 4

post #31 of 106
Quote:
Originally Posted by HAF_wit View Post
I always liked the article by benchmark reviews when it came to application since he also did other popular styles of application. You can find it here.

I personally have seen better results from the modified cross pattern on EK blocks, but the rice-grain has always been my favorite since air-cooling days.
I guess that "Overclocker in Training" tag is going to stay. For the last ten years I thought the point of TIM was to provide an extra buffer for heat coming from the CPU on its way to the heatsink. Thanks to that link I know that it is only supposed to provide a filler for any microscopic gaps on the surfaces of either piece of metal so that there is always 100% contact.

Thank you so much! Going to use much less TIM now and probably not going to bother spreading it with an "buy 10 get 1 free sub" plastic card anymore.
post #32 of 106
I personally squeeze out about a dot half the size of a grain of rice, then spread it out a little bit with a razor.

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post #33 of 106
Quote:
Originally Posted by Mapex View Post
I guess that "Overclocker in Training" tag is going to stay. For the last ten years I thought the point of TIM was to provide an extra buffer for heat coming from the CPU on its way to the heatsink. Thanks to that link I know that it is only supposed to provide a filler for any microscopic gaps on the surfaces of either piece of metal so that there is always 100% contact.

Thank you so much! Going to use much less TIM now and probably not going to bother spreading it with an "buy 10 get 1 free sub" plastic card anymore.
I honestly think we're all "overclockers in training" to some extent. With as fast as technology moves, we're all constantly learning. Spreading TIM isn't necessarily a bad thing, it just comes down to how much TIM you are able to spread in uniform directions. Some folks dispute this method all together as it has the potential to create really small air pockets, but it all comes down to what works for you.

I'm one of those OCD folks that absolutely must get the most out of my computers, so I'll yank off my heatsinks probably a good 15-20 times before I'm happy. All of this for a measly 1-3 degree difference at load which can always be attributed to software/ambient differences/microscopic faults in application/tension of the heatsink mounts/etc. This is probably why you'll see so many folks poo-pooing all over these types of articles as they see the best results from their own method that they have tried and tested over and over again.

(At least you're using a plastic card to spread the TIM, using your finger can leave traces of oil which defeats the purpose of using TIM.)
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post #34 of 106
they didn't test my favorite.
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post #35 of 106
Lol at method seven, for me i just put a pea size dot and the weight/pressure of the heatsink spread it so it cannot create air bubbles.. Just the method i like to use.
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post #36 of 106
I'm one of those OCD folks that absolutely must get the most out of my computers, so I'll yank off my heatsinks probably a good 15-20 times before I'm happy.


Sounds like a time consuming process,usually I yank off just once and I am happy.
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post #37 of 106
Small 5mm line in the middle and let the pressure between the heatsink and CPU do the rest.
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post #38 of 106
I put all my thermal pastes into my old Zalman STG-1 container and use the brush to paint it onto my chip. Net's me some very good temps.
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post #39 of 106
Grain of rice sized dot in the center and tighten like no other.
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post #40 of 106
Bad temps are usually the result of

1)Improper cleaning of previous TIM
2)Using too much TIM
3)Incorrectly mounted cooler

Rather than whether you used a line or a dot or an X or a thin even spread.
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