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[HS] What is the Best Way to Apply Thermal Compound? - Page 9

post #81 of 106
^ meh AS5 is passed it's time, it's still one of the best performing but others will match of even beat it while being non conductive and having no cure time.
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post #82 of 106
smiley face pattern ftw
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post #83 of 106
Quote:
Originally Posted by Blameless View Post
I wish TIM reviews would test longevity.
Umm.... lol.
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post #84 of 106
I simply use the small dot for a while now, and it's been great
    
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post #85 of 106
Quote:
Originally Posted by arshinel View Post
this http://www.overclock.net/air-cooling...ml#post8378679

this is a post form me long time ago.
the MB i am talking about is asus deluxe v2 and i can bet this is whats happening when the brackets of the MB are pusshed over the ihs, at least thats what happens with this MB . Who know maybe that bracket is to powerfull and changes the shape of IHS , but some ppl do realise that it takes a little bit o presure to mount the CPU on the MB and the ihs is made of copper not steel. nut any way, the fact is a fact, and now i cant prove it, as i dont have the i7 950 (lapped cpu) any more, and my actual i7 980x is not lapped , and i will not. so in my opinion to lap a cpu is better to do it mounted on MB, wich is imposible,
all this may sound crazy, but it really happend to me, (maybe i lapped like a crazy guy all the ihs? not really)
be sure i spend allot of time and money on lapping tools
so any way, i trust INTEL that when they spend so much money into CPU's and tech, they could make so easy the IHS flat like glass
The retention bracket that holds the CPU in place doesn't put enough force on the CPU to bend it--just enough to hold it in place--at least, not in any of the intel motherboards I've ever used.

To address the portion in bold, it's easy to make something flat. It's difficult to do that when you have to make a lot of an item cheaply. When you're manufacturing millions of CPU's, and want to keep the price down so customers actually want to buy your product, there's no point in making IHS surfaces flat and level like a mirror when something much more rough and uneven still gets the job done.

Quote:
Originally Posted by homestyle View Post
Dude might have the right idea.

Sometimes people on these enthusiast sites get so caught up in saying the same thing over and over and over (to the point of being wrong)... like how AS5 is the best tim, gentle typhoons will drastically reduce sound, etc.

Read things with an open mind and don't repeat the same things over and over.
Reading something with an open mind is one thing. Actually believing that it could happen is something completely different when there is no indication from everyone else that's used the product(s) that this is happening.
Edited by guyladouche - 6/13/11 at 6:15am
    
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post #86 of 106
Quote:
Originally Posted by guyladouche View Post
To address the portion in bold, it's easy to make something flat. It's difficult to do that when you have to make a lot of an item cheaply. When you're manufacturing millions of CPU's, and want to keep the price down so customers actually want to buy your product, there's no point in making IHS surfaces flat and level like a mirror when something much more rough and uneven still gets the job done..
so, intel didnt made a PERFECT flat surface to cpu's, and let us do it?? does intel encourage this ? i think not , and u right there is no need to make the IHS flat cuz is ok the way it is , im sure some MB brackets apply more presure on ihs and some other mb's less pressure.

and on topic, when applying AS5 (for eg.) you get much more better results in a worm ambient, then in a cold one. last winter when i mounted the new i7 980 , my room was cold, and so do the AS5 tube, and it was so hard to take it out , there is when i came with the idea to warm up the heatsink so when it touches the compound it will melt down between the IHS and CPU and just the exact layer of compound will remain between them. so when the compound is thick , the layer between the 2 will not disipate the heat properly,
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post #87 of 106
DOT, X, t- depends on the cooler.
post #88 of 106
btw, the article is wrong. on page 2, they say the tiny dot was not enough to cover the cpu surface.

it's not enough to cover the ihs, but the cpu surface was covered.
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post #89 of 106
Quote:
Originally Posted by homestyle View Post
btw, the article is wrong. on page 2, they say the tiny dot was not enough to cover the cpu surface.

it's not enough to cover the ihs, but the cpu surface was covered.
Looks to me like the corners weren't covered, so technically the article isn't wrong.
Quote:
Originally Posted by Article
As you can see, the amount was not enough to cover the entire CPU surface.
 
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post #90 of 106
Quote:
Originally Posted by guyladouche View Post
The retention bracket that holds the CPU in place doesn't put enough force on the CPU to bend it--just enough to hold it in place--at least, not in any of the intel motherboards I've ever used.

To address the portion in bold, it's easy to make something flat. It's difficult to do that when you have to make a lot of an item cheaply. When you're manufacturing millions of CPU's, and want to keep the price down so customers actually want to buy your product, there's no point in making IHS surfaces flat and level like a mirror when something much more rough and uneven still gets the job done.



Reading something with an open mind is one thing. Actually believing that it could happen is something completely different when there is no indication from everyone else that's used the product(s) that this is happening.
It's so funny. About 6 months ago, some dude got flamed for posting that his ek nickel blocks were flaking and the cause was poor manufacturing. He got flamed up the wazoo.

I'm not saying believe it. But don't flame the dude for trying to share his experience. (i'm not singling you out and saying you flamed him, but speaking in general terms).
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