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[HS] What is the Best Way to Apply Thermal Compound? - Page 10

post #91 of 106
Quote:
Originally Posted by HothBase View Post
Looks to me like the corners weren't covered, so technically the article isn't wrong.
technically, they were wrong.

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post #92 of 106
Since I have a quad core I use the 2 line method, but on single cores just a pea size dot works for me.
post #93 of 106
Quote:
Originally Posted by homestyle View Post
technically, they were wrong.

Your post implies that your definition of "entire CPU surface" is only the area directly above the actual die.

I disagree.
 
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post #94 of 106
I don't understand viewpoint of it not mattering if the corners are covered since the cores are only near the center. The entire top of the CPU is naturally going to heat up as the heat dissipates, not just the center where cores are actually in contact with it. Therefore any extra contact with the heatsink is only beneficial.

He obviously botched the full coverage applications because it's spilling out the sides. The lines were too long. There's a point where having too much essentially turns the TIM into a slight insulator instead of aiding in thermal transfer.

The difference is negligible and doesn't particularly matter, but it's still relevant.
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post #95 of 106
surprised the ALOT one was only hotter by 3 lol
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post #96 of 106
Quote:
Originally Posted by lol discover View Post
The IHS will still conduct and distribute heat so it would be a smart idea to apply enough TIM to coat most of the IHS regardless of where the die is located.
this.
also does anyone know the material of the IHS? copper or aluminum?
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post #97 of 106
Quote:
Originally Posted by james8 View Post
this.
also does anyone know the material of the IHS? copper or aluminum?
isn't it copper and with nickel over it to give it the grey/silver look?
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post #98 of 106
Quote:
Originally Posted by HothBase View Post
Your post implies that your definition of "entire CPU surface" is only the area directly above the actual die.

I disagree.
Regardless, who cares. It doesn't matter. But don't say "technically" when you mean in "layman" terms.


Quote:
Originally Posted by lol discover View Post
The IHS will still conduct and distribute heat so it would be a smart idea to apply enough TIM to coat most of the IHS regardless of where the die is located.

Did you guys not read the article?

It's been proven time and time and time and again and again that it's beneficial not to coat the entire ihs with tim.

Find your cpu on here:

http://www.arcticsilver.com/intel_ap...n_method.html#

and then use enough tim to cover the cpu die only.
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post #99 of 106
I've always used a small dot with great results. The spread method requires unnecessary work which the cooler can do instantly.
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post #100 of 106
Quote:
Originally Posted by homestyle View Post
Regardless, who cares. It doesn't matter. But don't say "technically" when you mean in "layman" terms.
I care. Maybe I'm one of those annoying people who care too much about the small stuff. But I thought you cared as well since you were the one to comment on the author's choice of words in the first place.

I thought the CPU was indeed technically the entire package, IHS and all. Prove me wrong and I shall most definitely not argue the case any further.
But by your definition, a Core 2 Quad would be two CPUs?
Quote:
Originally Posted by homestyle View Post
Did you guys not read the article?

It's been proven time and time and time and again and again that it's beneficial not to coat the entire ihs with tim.
In theory, a layer of TIM spread perfectly over the entire IHS without any excess bleeding on the edges is optimal. Look at method two in the article, it does not perform any worse than method one, so I can't see a full cover doing any harm if done properly.
 
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