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GTX 570 reference... i think i should be worried?? - Page 2

post #11 of 26
Looking at that picture it seems highly likely that the problem is due to the fact that the heat from your CPU is sitting right below the intake for that GPU, this is compounded by the fact that the radiator itself is obstructing airflow that would normally go unobstructed to the GPU. I would only change the position of the GPUs if it meant that you could fit the pull fan back on there, other than that I doubt you will see any difference.
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post #12 of 26
Dont worry, I'm getting the same temps as you

EDIT; well a little lower but you get the point
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post #13 of 26
Try it with the reference card on the outside (farthest from cpu), that way its not sucking in the heat from the HD version (I had a Raven 2 also and 2 5850 Toxics and had this issue).
75c is hot though for your card, I leave mine at 60%fan speed and while gaming it sits at 60-63c (I replaced the tim though). Try to reapply the paste and make sure the reference card is on the outside. See if that helps.
 
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post #14 of 26
Thread Starter 
Quote:
Originally Posted by nagle3092 View Post
Try it with the reference card on the outside (farthest from cpu), that way its not sucking in the heat from the HD version (I had a Raven 2 also and 2 5850 Toxics and had this issue).
75c is hot though for your card, I leave mine at 60%fan speed and while gaming it sits at 60-63c (I replaced the tim though). Try to reapply the paste and make sure the reference card is on the outside. See if that helps.
thanks... i'll try reapplying shin etsu this time.

i think i didn't do a good job reseating the hs on the gpu
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post #15 of 26
Quote:
Originally Posted by badatgames18 View Post
thanks... i'll try reapplying shin etsu this time.

i think i didn't do a good job reseating the hs on the gpu
The way I did it was I used the credit card method and applied it to the heatsink so it was nice and smooth then applied a small drop on the gpu ihs. Worked pretty well.
 
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post #16 of 26
Quote:
Originally Posted by nagle3092 View Post
The way I did it was I used the credit card method and applied it to the heatsink so it was nice and smooth then applied a small drop on the gpu ihs. Worked pretty well.
I've always heard that way has a high chance of air bubbles, and that the "best" way is just a single dot of varying size, i.e. grain of rice for CPU, probably more like a pea or bean for a GPU. Especially with a vapor chamber cooler the single dot method shouldn't give you any problems, it's the direct touch heatpipe coolers where you can run into issues with a single dot spreading wrong because of the grooves.
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post #17 of 26
Quote:
Originally Posted by juano View Post
I've always heard that way has a high chance of air bubbles, and that the "best" way is just a single dot of varying size, i.e. grain of rice for CPU, probably more like a pea or bean for a GPU. Especially with a vapor chamber cooler the single dot method shouldn't give you any problems, it's the direct touch heatpipe coolers where you can run into issues with a single dot spreading wrong because of the grooves.
Well that would work providing the heatsink base is perfectly flat which it wasnt with my card. Thats why I evenly spread it with a card on the heatsink base (to make it flat), then applied a small drop on the gpu ihs. That way theres little risk to any air bubbles.

Read it a couple times slowly, you'll get it

Edit:You still didnt read it
Edited by nagle3092 - 6/15/11 at 5:15pm
 
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post #18 of 26
Quote:
Originally Posted by nagle3092 View Post
Well that would work providing the heatsink base is perfectly flat which it wasnt with my card. Thats why I evenly spread it with a card on the heatsink base, then applied a small drop on the gpu ihs. That way theres little risk to any air bubbles.

The whole video is informative but I think 1:50 may surprise you.
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post #19 of 26
My assessment in 2 parts:-

1) Solving the local problem
PNY GTX570 non reference cooling has a cooling design of exhausting hot air via its rear, top, bottom and front. According to the fins orientation and layouts and the fact that 2 of the 3 heatpipes are on the front side, I estimate that 60% of the total heat is exhausted out via the front. Perhaps 30% via the rear (out of the case), 10% via the top and the bottom. So, the main portion is through the card's front. See pic 1.

This amount of hot air should be extracted out of the case without going through and warming up other components. The 3 possible escape routes (as shown in my previous post #7) all contribute negatively and ought to be avoided. However, as you are not using an air cooler for your CPU and that the rad is placed at case bottom, escape Path 3 is the least-harm-done route.

So, I suggest you to rearrange the cards as shown in pic 2 below.
a. non reference GTX570 in 1st PCIex16 slot. A strong cardboard paper or plastic 'elbow' is put at its front to direct the exhaisting air to turn right and upward. This Path 3 minimizes/eliminates the harm.
b. reference GTX570 in 2nd PCIex16 slot
c. sound card in 1st PCIex1 slot

2) Dealing with the global problem
As the triple rad is placed at case bottom, all uprising air is warmed. This more or less violates the basic design feature of RV02, IMHO. This stream of warmed air will now affect negatively all components inside the case. See pic 3.

To solve this, you may consider ditching the triple rad at the bottom and 'downgrade' to a single rad (eg Corsair H80) to be installed at the case top. A triple rad cooling your CPU alone is a little wasteful, IMHO.
If you make this change, cool ambient air will be able to cool both your cards better. See the green arrows in pics 4 and 5. Other arrangements need to be made (eg placing a PCI slot fan extractor, shown blue in pics 4 and 5, to intercept the hot air from non reference GTX570 so that those air will not go through the rad at case top).

Basically, it all boils down to a choice between better cooling for the 2 cards or for the CPU.

Edit 1:
' warming up' is deleted above as this is not an accurate description. Even the warmed up air (after passing through the rad) is not hotter than other components and so the direction of heat transfer is still from a component (eg graphic card's heatsink) to the warmed air. More accurately put, the cooling capacity is reduced.





Edited by windfire - 6/15/11 at 7:33pm
post #20 of 26
Thread Starter 
Quote:
Originally Posted by windfire View Post
My assessment in 2 parts:-


**SNIP
wonderful analysis... it'll give me something to think about (downgrading rads), i'll try out your suggestions and see what my results are

thank you very much for such a thoughtful input

The only thing i am weary off is that i have a high overclock and i'm afraid temps might rise too significantly if i downgrade
Edited by badatgames18 - 6/15/11 at 6:57pm
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