Originally Posted by musty989
Hey guys, I have a question that I hope somebody here can help me with. I have had the 970a-ud3 for 4-5 months now running an Athlon II x4 630 with a corsair H100 cooling kit. I've read through this entire thread and decided to follow one of the members who took off the thermal pads from his MOSFET's and Northbridge heatsink's and applied some thermal paste to lower the temps.
I went ahead with this using some MX-4 and ended up with negative results with both my NB and Mosfet temps(TMPIN1 & TMPIN2) rising +2-5 C degrees while under load from Prime95 & Intel Burn-in test. My ambient room temperature didn't change nor did my CPU temp change either. Before I did this, under load my TMPIN1 was maxing out at 42C and my TMPIN2 at 49C, and afterward TMPIN1 = 46C TMPIN2 = 53C.
So my question after researching is, when I removed the mosfet and NB thermal pads and applied MX-4 in there place, did I apply too much MX-4 (i just dabbed some in the center of NB and spread and I covered all of the mosfets with a q-tip cut in half which covered all of the chips but left extra and uneven TIM on top which I thought wouldn't have been overkill considering it had a thermal pad to begin with). Or my other thought was that the thermal pads were thicker and provided a tighter fit between the mosfet chips and heatsink, so when I took them off it left them with more space between the two which reduced the ability for the heatsink to properly transfer heat. Anyway, hope somebody who has done the same thing can help me out. I was under the impression that the MX-4 would have lowered the temps at least a little bit, so should I reapply TIM and use a credit card to properly even out the TIM or does my thought on the gap created from removing the thermal pads hold any merit?
Btw, My x4 630 is clocked at 3738MHz @ 1.52V, CPU NB CID +.100V, NB 2670MHz. My FSB's top stable setting seems to be 267, after that I start to hit a wall regardless of my settings, is this a good range for this board?
You should never remove the thermal pad for the mosfets as I dont think using an actual TIM works for mosfet cooling. It is always typically thermal pads on mosfet coolers whether stock or aftermarket. However, you can use TIM on the NB and it should end up cooling it better than a thermal pad. I used TIM on my previous board (GA-MA790XT-UD4P) and saw much better temps on the NB. Though since the contact area with the heatsink and NB is much smaller than that of a CPU cooler and CPU, I used a very.... very small amount of TIM. When applying it to the NB, use less than the "grain of rice" size that is recommended for CPUs. Do not spread it over the surface area of the NB either.
However, you did mention a noticeable gap since removing the thermal pad so that might be the cause of the issue (at least on the mosfets). In all honesty, you might want to look into an aftermarket solution such as the HR-09 and HR-05 heatsinks from Thermalright.