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What is the Best Thermal Compound Application Method? - Page 3

Poll Results: Choose your favorite method.

 
  • 6% (4)
    X
  • 73% (46)
    Dot
  • 1% (1)
    Circle
  • 0% (0)
    Diagonal
  • 7% (5)
    horizontal/vertical
  • 11% (7)
    other (please explain)
63 Total Votes  
post #21 of 27
Quote:
Originally Posted by Farih View Post
Look in the manual of the TIM, some require various ways for various cpu's
Most commen is the dot method though.

Example: Artic Silver 5
1.http://www.arcticsilver.com/intel_ap...n_method.html#
2.http://www.arcticsilver.com/amd_appl...n_method.html#
Nice links. Thank you.
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post #22 of 27
Hi guys, would the dot method be effective for a GPU block too? I've been doing spread method for most of my "thermal pasting career" and just found out that it's pretty silly to do.

Would it be worth it to redo my thermal for my waterblock of my CPU now or can I wait until I get my waterblock in probably like a week until performance PC has them in stock?
Temps have been ok, but not great. Around 60c load.
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post #23 of 27
Thread Starter 
Quote:
Originally Posted by LivingChampion View Post
Hi guys, would the dot method be effective for a GPU block too? I've been doing spread method for most of my "thermal pasting career" and just found out that it's pretty silly to do.

Would it be worth it to redo my thermal for my waterblock of my CPU now or can I wait until I get my waterblock in probably like a week until performance PC has them in stock?
Temps have been ok, but not great. Around 60c load.
if you're about to get a new CPU block i don't see the point; that is, unless you'd like to practice It's always good to seat a few times and look how much coverage you got using a certain amount of TIM and a certain amount of preassure to spread. Practice makes perfect .


after starting this thread i've learned much more about how TIM spreads and burns in. It really all depends on your heat sink and what you're mounting it to. Like, if i were to mount a heat sink to a rectangular thermal plate for my NB or something then obviously i wouldn't use the dot method; i would prolly use the line since i would want coverage all the way accross the block.

The dot works extremely well for a thermal plate with a square base (ie. a CPU) and a flat heat sink. Keep in mind though, if you're using copper coil sinks, you'll want to make sure to spread the TIM into the cracks around the coils. You don't want air gettin in between your hot crap.

post #24 of 27
Oh, I'm not getting a new CPU block, I meant my GPU block. I just tried the dot method for my CPU and temps seem to be the same for the most part, maybe worse.
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post #25 of 27
Thread Starter 
Quote:
Originally Posted by LivingChampion View Post
Oh, I'm not getting a new CPU block, I meant my GPU block. I just tried the dot method for my CPU and temps seem to be the same for the most part, maybe worse.
did you give it time to burn in?
usually it takes a little while for the thermal compund to set for it to be at its peak performance.
post #26 of 27
Yeah, I gave it time to burn in. It's about the same temps as the spread method give or take. At-least it doesn't waste a lot of thermal paste though.
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post #27 of 27
Thread Starter 
Quote:
Originally Posted by LivingChampion View Post
Yeah, I gave it time to burn in. It's about the same temps as the spread method give or take. At-least it doesn't waste a lot of thermal paste though.
yea the temps wont be crazy noticable, but for people like me, i want to get THE BEST possible temps reachable with what i have. so i always take any little extra procedure to get that 1 or 2 degrees.

It adds up in the end though, specially if you do it on all of your devices.
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