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Cracking line on i7 960 die - Page 5

post #41 of 43
Thanks, I was just trying to figure out how you assured yourself, that the lapping would come out flat.

Edit: I hope you meant Plate Glass! lol
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Game Killer
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post #42 of 43
Thread Starter 
Quote:
Originally Posted by TitaniumClocker View Post
The lab I got to demo, they used a flammable material/liquid to burn off excess silicon to reduce thickness lol

Not saying this is a good idea, so don't sue me if you loose some eyebrows


If this works out for you I will be impressed, as Blameless mentioned, the newer CPUs are not as rigid as they used to be


I miss being able to use 8 gauge steel backplates and put enough pressure to make it flex
Hoho, it might be liquid enchant. Wet etching is very common for silicon. I will try it first with my dead 920 chip.
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post #43 of 43
Quote:
Originally Posted by Slappa View Post
+rep. Many people are misinformed, or have no experience in removing IHS' themselves.
I wonder why. Maybe it has something to do with the fact that they are attached to the die with solder that needs to be heated very hot to remove, then the solder needs to be cleaned off the die (sanding) and after all that, the CPU is at significantly greater risk of being damaged even by simply mounting a heatsink or waterblock, many of which are tightened down corner by corner, which risks uneven pressure on the die which can crack it and kill it instantly. And when you get past all that, you then have to deal with in a lot of cases that the heatsink or WB you are trying to mount was designed to work with a CPU that is the height it was with the IHS.

Nah, that can't be it.
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