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Sadly, even with the AXP I cannot hit 1000 core on my 560Ti... - Page 4

post #31 of 52
Quote:
Originally Posted by Lord Xeb View Post
I have the VRM heat sinks that come with the AXP and applied properly. They work actually better than the stock heat sink. VRMs run at about 75C or so (measured with a IR gun on the back side of the card)


Where are the inductors? Are they the coils that are just after the VRMs? those bloody bastards run hot as hell!
Are they these things?

Yes- Inductors = Chokes

They are the same thing.. and they regulate the fluctuations in output power to the GPU core. The mosfets do not generate most of the heat in this area [as most people think]..its actually the inductors that do most of the work at high clock speeds and voltages. Put heat sinks on them and make sure they are cooled well.

*Just lowering inductor temps on my 6950 and 470 allowed for another 30-70mhz on the core at the same voltage.
post #32 of 52
Quote:
Originally Posted by CL3P20 View Post
Yes- Inductors = Chokes

They are the same thing.. and they regulate the fluctuations in output power to the GPU core. The mosfets do not generate most of the heat in this area [as most people think]..its actually the inductors that do most of the work at high clock speeds and voltages. Put heat sinks on them and make sure they are cooled well.

*Just lowering inductor temps on my 6950 and 470 allowed for another 30-70mhz on the core at the same voltage.
Hmm
I'm installing AXP on my 560ti next week.
I ordered enzotech bmr-c1 heatsinks and planning on putting them on the mosfets.
Now that you said this thing I'm wondering what I should do about the chokes..
I can't install heatsinks on top of the chokes since there ain't gonna be enough room between them and the AXP. So should I stick some heatsinks that come with the AXP on the backside of the card?
Would it help at all?

Sent from my HTC Desire using Tapatalk with this enabled just to annoy you.
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post #33 of 52
Depending on PCB layout, its not always possible to 'sink' the back of the PCB.. if there isnt anything mounted behind them..then certainly throw some sinks there! But if there are tiny resistors or other components, I would not recommend it, as you may end up shorting them out on accident.

*Zalman makes very good low profile heat sinks.. little blue ones that come in packs of 8-10 if im not mistaken.. I have bunches of them. Im not sure what kind of clearance your dealing with.. but they are pretty short compared to other brands..which is why I use them
post #34 of 52
Thread Starter 
Just ran Metro 2033 benchmark with the game maxed out with physx enabled on the GPU (9800GTX+ has been removed for now) and I hit no higher than 48C. No artifacts, not instability, runs great!
 
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post #35 of 52
Argh, just spent around 20mins writing a reply to you CL3P20 on my htc desire and then I punched wrong button and pheew all of the text to bitgraveyard.
Sigh. So a new try A bit shorter now though..

Quote:
Originally Posted by CL3P20 View Post
Depending on PCB layout, its not always possible to 'sink' the back of the PCB.. if there isnt anything mounted behind them..then certainly throw some sinks there! But if there are tiny resistors or other components, I would not recommend it, as you may end up shorting them out on accident.

*Zalman makes very good low profile heat sinks.. little blue ones that come in packs of 8-10 if im not mistaken.. I have bunches of them. Im not sure what kind of clearance your dealing with.. but they are pretty short compared to other brands..which is why I use them
Okay so.. Could you please enlighten me about the bolded text? Honestly I didn't catch all of that
Well, here are some high-res pictures of my card, front and back. Hope those help you to clarify this thing.
Images property of TechPowerUP and taken from this web address TechPowerUP - MSI GeForce GTX 560 Ti Twin Frozr II 1 GB - page #3

Below picture, that blue dot, from there right to left: cap, choke and mosfet?


And about the clearance.
AXP's height restriction pdf shows that there is around 13mm of space between the pcb and the cooler itself.
So the Enzotech BMR-C1 copper heatsinks are 14mm tall.
So 13mm clearance minus ~1mm from mosfets, 12mm.
Someone here on OCN on the msiAlex thread told me that I could bend the copper heatsinks if they don't fit.
Yeah I could, but I'd rather grab a sheet of wet sandpaper and sand away the couple of mm's of extra. Yes, I'll lose some of the cooling area but I won't have to worry about short circuiting something or w/e.

By the looks of the capacitors and chokes, I would guess that they are around 8-9mm tall.
So that would leave me with 3,5-4,5mm of clearance
And the Zalmans you mentioned, by any chance these were the ones you meant? Too tall, could sand them down aswell though but only 4x "low profile" ones...
Are there even available any heatsinks with the size of that
I looked through the 3 major computer online stores and couldn't find any.

I don't remember anymore what else I wrote previously (lmao) but I've already spent more than 30mins fine tuning this text so
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post #36 of 52
Thread Starter 
Some chokes are simply too talk to put heat sinks on them in the first place. I fitted mine with some sinks from a musashi kit and there is about a mm of space left XD

Anyways here is where you put your heat sinks


Edited by Lord Xeb - 7/20/11 at 9:36pm
 
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post #37 of 52
Quote:
Originally Posted by CL3P20 View Post
Yes- Inductors = Chokes

They are the same thing.. and they regulate the fluctuations in output power to the GPU core. The mosfets do not generate most of the heat in this area [as most people think]..its actually the inductors that do most of the work at high clock speeds and voltages. Put heat sinks on them and make sure they are cooled well.

*Just lowering inductor temps on my 6950 and 470 allowed for another 30-70mhz on the core at the same voltage.
I think it would be good to mention that this method is really only important on cards with lower numbers of phases that put out more power each. If you have lots of chokes and mosfets they will just not get as hot, and not have overheating issues in the first place. Something like that TF2 560 posted below would be an alright example.

in cases where there are lower numbers of phases and higher temps clepto is 100% right
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post #38 of 52
Thread Starter 
Quote:
Originally Posted by wumpus View Post
I think it would be good to mention that this method is really only important on cards with lower numbers of phases that put out more power each. If you have lots of chokes and mosfets they will just not get as hot, and not have overheating issues in the first place. Something like that TF2 560 posted below would be an alright example.

in cases where there are lower numbers of phases and higher temps clepto is 100% right
agreed. As long as the 560 Ti TF2 has sinks on the VRMs, the card is happy.


BTW guys I got 1000 core going here ^_^
 
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post #39 of 52
Quote:
Originally Posted by Lord Xeb View Post
BTW guys I got 1000 core going here ^_^
Moar... you must try for MOAR!

Nicely done Xeb
post #40 of 52
Quote:
Originally Posted by Lord Xeb View Post
agreed. As long as the 560 Ti TF2 has sinks on the VRMs, the card is happy.


BTW guys I got 1000 core going here ^_^
What memory speed are you using, and what voltage?

I did some quick testing on this 560 Ti FPB with reference cooler, that I have sitting here, and I wasn't able to hit 1ghz on the core without articulating. Not that I'm bothered by that, it's on a reference cooler and the chip may just not be up to the task.
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