Originally Posted by Phantom_Dave
Definitely figure 8. The same process is used in high precision metal working. Using any movement other than a figure 8 is much more likely to take off more material in a localized area instead of an even amount over the entire surface.
If you just went back and forth you'd likely end up with an angled surface instead of a planar surface.
I like ... well ... how can a figure of 8 possibly be uniform with a human arm ?
Shall do it nevertheless..
Originally Posted by Tori
does that ruin the cpu? i dont understand what lapping does lol
What about copper being exposed to the atmosphere now ?
Wonder how it'll fare.. the whole thing's not going to be covered in thermal grease . I fear for it .. I do live in a humid area
and the copper on my old hyper 212+ DID loose it's sheen and turn really dull and partially black too at some points.
So should I in that case simply take a 600 Grit paper and polish it till the first signs of copper emerge ?? Forget the whole mirror finish and hope for a better than before surface ?
Unless, my apprehensions are entirely baseless...
I've never had a processor fail on me so the warranty is NOT a concern..
ALSO , I may in the future sell this processor off for BD . .. will aluminum and copper in contact create problems like they do in waterblocks?
Originally Posted by compuman145
Yep, sandpaper, start off at around 600 grit and move up to 2400 grit.
Worked a treat on mine
So I'll take 600 --> grind it a bit .. the second I see a bit of copper , I'll switch to a higher grit and try not to expose too much copper ?
Thanks folks !