Originally Posted by IIVisionII
Alright. Got it back in again. Here's some pics. The first one is what the heatsink looked like after i removed it after attempt #2. The next one is my attempt at a star pattern.
Checking temps now.
You need MORE TIM. MOAR
Applying tim on an exposed die versus an IHS is as different as you can get. For an exposed die you want the excess spilling over the sides. You want the entire die covered. You see in your first picture, the entire die is not covered. That is producing heat.
Of course, I'm oversaying it, but too many people are saying you are using too little. The right amount is when you have just a smidge spilling over the sides. It will take a few applications to know the right amount. You see the AMD application? That was the right amount. Just a smidge was spilling over.
The IHS is usually 30-100% larger than the actual die. So covering the whole IHS is not as critical because in most cases, the spread will cover the die underneath. But for exposed dies, make sure a little bit of the excess spills over.
Originally Posted by tsm106
That's not applicable to gpus because they are under spring tension. You get the screws tight enough to get the springs to push on the pcb.
The springs on the 6900 cards are not for pushing against the bracket to tighten down on the pcb. They are VERY weak springs. I can blow on them and make the compress. The springs are there so the bracket/screws comes off easily after unscrewing them. They also keep the screws from coming away from the bracket.
1 thing you can try is to do a popsicle mod. Get some flat toothpicks or wood popsicle sticks and stick them under the square bracket. That should give you more pressure on the gpu.Edited by homestyle - 8/6/11 at 11:32pm