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How is my TIM application?

post #1 of 28
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I did this by making a pea drop of thermal paste on the CPU then spread it out with a razor. I'm not sure how I feel about the result tho.
    
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post #2 of 28
Don't spread it out with a razor. Doing so may leave parts uncovered by the TIM. Just mush the heatsink down on the pea-sized drop, and screw it down.
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Marshmallow
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post #3 of 28
let the pressure from the block while screwing it do the spreading.. Just leave a pea sized tim in the middle of the procie and you're done.
AEON
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AEON
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post #4 of 28
meh, tim application.... I think... is just a matter of preference. I don't think any paticular way is better than another unless HSF is direct contact pipes, in which case you may want to spread tim in around the pipes on hsf unit...
post #5 of 28
Bad application, clean it. Put a pea TIM on CPU and let it that way. Put heat sink, apply some pressure and it will spread itself.
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Sandy love
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post #6 of 28
When you spread it mate, the air gets sealed in where as if you do a pellet in the centre. The paste will push the air out as it spreads with the pressure of block.
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^3
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post #7 of 28
Agreed about letting the pressure from the hs spread it. Otherwise you get lots of air bubbles in there, and air bubbles are not a good thing
post #8 of 28
I would agree with reapplying. Also, don't add too much, a pea sized drop is enough. Too much is bad as well.
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post #9 of 28
Pea-sized is too much. Rice grain FTW.
post #10 of 28
Best TIM application methods.
 
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