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How is my TIM application? - Page 2

post #11 of 28


You only use tim on chip surface or heatsink surface, not both. After that much drop(you can even use half of that on flat surfaces), put the heatsink on and apply some pressure then turn the heatsink a bit left and right then bolt it on. This makes it a bit more spread without air.
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post #12 of 28
Quote:
Originally Posted by Catscratch View Post


You only use tim on chip surface or heatsink surface, not both. After that much drop(you can even use half of that on flat surfaces), put the heatsink on and apply some pressure then turn the heatsink a bit left and right then bolt it on. This makes it a bit more spread without air.
This. Or thin strip of a line but use the same amount. Never spread.
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post #13 of 28
I look at that pic, and I can see white specks of stuff on that. (Edit: the last pic...not the OP's original)

Tsk tsk...should have used surface purifier.

When "smoothing" it, using a razor blade is a bad idea. Why? Because its edge is rigid. That means if there's a slight bend/nick on the blade/edge, you are gonna have imperfections in the flatness of the application.

My suggestion: Find a business with the lightly laminated, paper business cards. As you use those to smooth out the TIM, the excess builds on the flat of the card and fills gaps and the edge pulls off excess.

I've done dozens of CPUs this way, the entire surface of the CPU is always guaranteed to be covered evenly, and I always run cool or cooler than most others.
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post #14 of 28
Quote:
Originally Posted by jck View Post
I look at that pic, and I can see white specks of stuff on that. (Edit: the last pic...not the OP's original)

Tsk tsk...should have used surface purifier.

When "smoothing" it, using a razor blade is a bad idea. Why? Because its edge is rigid. That means if there's a slight bend/nick on the blade/edge, you are gonna have imperfections in the flatness of the application.

My suggestion: Find a business with the lightly laminated, paper business cards. As you use those to smooth out the TIM, the excess builds on the flat of the card and fills gaps and the edge pulls off excess.

I've done dozens of CPUs this way, the entire surface of the CPU is always guaranteed to be covered evenly, and I always run cool or cooler than most others.
It doesn't matter what you use since spreading it creates the micro air bubbles either way.
That is why you don't want to spread.
It is basically same thing as you put the heatsink on and take it off then put it back on.
You don't do that. But when you spread, the same thing happens to the TIM and the surface.
Only way to eliminate that is to not touch the TIM once it is out from the tube.
Also there is no reason to cover the entire CPU heat spread with TIM.
Metal to metal contacts at the corners are perfectly fine since that is not the part that gets hot.
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post #16 of 28
Quote:
Originally Posted by KJ4MRC View Post
Good video. That is the proof of not to spread it yourself.
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post #17 of 28
Quote:
Originally Posted by the_beast View Post
Pea-sized is too much. Rice grain FTW.
Depends on the flatness of the mating surfaces and the consistency of the grease.
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post #18 of 28
Quote:
Originally Posted by Blameless View Post
Depends on the flatness of the mating surfaces and the consistency of the grease.
Direct touch heat pipe type (like 212+) needs a bit more than flat surface one.
But even that, less is always more.
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post #19 of 28
In my personal experience ive found that spreading does ( as many have said ) leave micro air bubbles thus raising the temps. Its not to say that spreading Thermal paste this way is all bad as it depends alot on the amount and viscosity of the paste itself as well as the Heatsink used. On all occasions now ( after many many many applications tried & tested ) i use a half pea sized blob on the centre of the cpu and use the pressure from screwing down the heatsink to spread the paste. The difference between this method and the spread method has been on average 3-4C better. Id suggest you remove the paste and retry using the methods suggested here by other members to find the best result for you. The paste is only to fill the microscopic gap between the cpu and hs , and this has to be a minimal amount for best results. So really, you need to find out by trial and error how much TIM you need for best results. If you do use the spread method there will be microscopic air bubbles that will increase temperatures ( only by minimal amounts ), this is only due to the fact that heat that would otherwise be transfered through the paste to the hs will now be trapped against the cpu kinda like broken bubble wrap. Anyways i hope this helps, but do keep trying different methods until you find what works for you
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post #20 of 28
Quote:
Originally Posted by Tunagoblin View Post
It doesn't matter what you use since spreading it creates the micro air bubbles either way.
That is why you don't want to spread.
It is basically same thing as you put the heatsink on and take it off then put it back on.
You don't do that. But when you spread, the same thing happens to the TIM and the surface.
Only way to eliminate that is to not touch the TIM once it is out from the tube.
Also there is no reason to cover the entire CPU heat spread with TIM.
Metal to metal contacts at the corners are perfectly fine since that is not the part that gets hot.
A) you'll get microbubbles if either surface isn't perfect too.

B) if you use a flexible, laminated card and have TIM on the surface and edge of the card (which you get from dragging the bead across the surface of the CPU), the TIM-to-TIM contact (using a slow dragging motion...as long as it's not thick TIM) produces a smooth surface. (Edit: At least, that's how it's been for me with AS5 and Ceramique...that's all I use)

C) spreading across the entire surface does make a difference. it's thermodynamics. the more area you have to diffuse the heat, the better it is. That's why heatsinks have fins...more surface area. and since metal to metal is considered inefficient (because of microfissures in the metal surfaces leave air pockets i.e.-microbubbles) for heat transfer, you should especially have TIM there.

I just don't risk that my bead is big enough and that the snugness of the CPU surface to the heatsink is going to be tight enough to spread the TIM out fully. When I mount the heatsink, I know there's TIM everywhere to meet it.

That's just how I do it.
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