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How is my TIM application? - Page 3

post #21 of 28
Quote:
Originally Posted by jck View Post
A) you'll get microbubbles if either surface isn't perfect too.

B) if you use a flexible, laminated card and have TIM on the surface and edge of the card (which you get from dragging the bead across the surface of the CPU), the TIM-to-TIM contact (using a slow dragging motion...as long as it's not thick TIM) produces a smooth surface. (Edit: At least, that's how it's been for me with AS5 and Ceramique...that's all I use)

C) spreading across the entire surface does make a difference. it's thermodynamics. the more area you have to diffuse the heat, the better it is. That's why heatsinks have fins...more surface area. and since metal to metal is considered inefficient (because of microfissures in the metal surfaces leave air pockets i.e.-microbubbles) for heat transfer, you should especially have TIM there.

I just don't risk that my bead is big enough and that the snugness of the CPU surface to the heatsink is going to be tight enough to spread the TIM out fully. When I mount the heatsink, I know there's TIM everywhere to meet it.

That's just how I do it.
A) No. The other way. TIM is to fill the microscopic gap between the IHS and heat sink. Not to create one.

B) Smooth to your eyes only but it is not. Did you watch the video above that spreading is clearly making the big air bubbles....

C) Not true. It is on that video also and confirmed by many other people.
You don't have to cover the entire IHS with TIM. It actually make it worse by pressing it down. It creates bubbles and also the TIM spills out from the sides.

Let the pressure does the job.
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post #22 of 28
With practice you can use a dot in middle and cover the entire IHS. In testing tim, first thing I do is test how much to use by applying then checking to see coverage, prior to doing any actual testing. After a few applications of any tim, you can get complete coverage once you learn how it spreads, without introducing bubbles/microbubbles by spreading yourself. On other hand, temps are only about a degree worse if spreading yourself, so if its what you like...but also over time those microair bubbles can become larger voids with worse affect on temps.
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post #23 of 28
imo a pea size isn't enough...... i dont know what peas you guys are using to think its enough but i guess they're american size.......

i personally am not happy unless the thermal paste covers 80%+ of the cpu when the hs is clamped down...i therefore do a solid line down 75% of the cpu, and +or- it compared with its consistency...

rice size? if i spread an english rice size over the cpu it wouldn't cover a quarter of it when clamped,

ive also noticed applying too much doesnt affect temps at all that much(literally 1-2*C), because it just squashes over the edge and stays there, applying too much ( in my book) is better than not applying enough, but people here will tell you differently because they want the *perfect* application

i've seen someone replace a cpu before and he didnt use any thermal paste whatsoever (yes, metal to metal contact) i went absolutely furious

in response to KJ4MRC's video, the only acceptable method was the cross method, in my personal opinion i wouldn't be happy unless it did that
Edited by Roksonixx - 8/5/11 at 7:03pm
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post #24 of 28
Quote:
Originally Posted by Tunagoblin View Post
A) No. The other way. TIM is to fill the microscopic gap between the IHS and heat sink. Not to create one.
If there are imperfections in the surface of the metal on either the heat sink or the heat shield...you will get micro bubbles trapped.

Quote:
B) Smooth to your eyes only but it is not. Did you watch the video above that spreading is clearly making the big air bubbles....
I watched it. And if you notice, he had incredibly noticeable gaps in his TIM application across the surface. Really bad job of applying it. Nowhere near uniform. Notice the gray areas he left open? If I left gaps that big, I'd expect that too.

So yeah...you do a poor job at applying it yourself, you're gonna get poor results.

Quote:
C) Not true. It is on that video also and confirmed by many other people.
You don't have to cover the entire IHS with TIM. It actually make it worse by pressing it down. It creates bubbles and also the TIM spills out from the sides.

Let the pressure does the job.
I've never had that issue at all.

Maybe me and my business card and the way i do it works good for me and i'm doing something special. Who knows.

Like I said...it's just the way I do it. I've never had a heat problem whatsoever...even using cheapo air cooling HSFs that other people swear off....sunbeamtech...rosewill...etc

And, I get just as good cooling results as anyone else. If I was getting a lot of bubbles (like the video showed), I wouldn't have good results cooling. So, I don't know what I'm doing right compared to that person...but, I'm doing something way better evidently.

I'd offer to get plexiglass and do that with my setup next time I build, but I don't have a video camera and don't have the desire to go spend the money doing it.

I'm not telling you not to do it your way...I'm just telling you I don't seem to have any of the issues that everyone claims comes by default of doing it the way I do it.
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post #25 of 28
Some people stuff around with this too much, Just spread it on like butter (but thin) or put a dab in the middle and screw or fit your HSF. 3-5°C don't make jack **** difference.
post #26 of 28
A good size rice shape is the best once you figure it out. Just a small line. Like long grain but fatter
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post #27 of 28
The person who applied the thermal paste on my e6750 before used waaay too much.

When I removed the Zalman cooler I found thermal paste had come out the sides almost on to the motherboard..

The way I applied thermal paste...

Pea size drop... actually smaller than a pea then spread it out with my finger in a plastic bag. Spread until the entire surface is covered in a VERY thin layer of thermal paste then apply heat sink.

My layer of thermal paste was EXTREMELY thin and after I booted up the pc the temps had dropped.. mind you only a few degrees. I guess my point is you don't need hardly any thermal paste at all to do the job.

In all honesty most methods are fine. Just don't use too much and get it on your mboard!
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post #28 of 28
Quote:
Originally Posted by timmay556 View Post
Some people stuff around with this too much, Just spread it on like butter (but thin) or put a dab in the middle and screw or fit your HSF. 3-5°C don't make jack **** difference.
Quote:
Originally Posted by 180sxboosting View Post
The person who applied the thermal paste on my e6750 before used waaay too much.

When I removed the Zalman cooler I found thermal paste had come out the sides almost on to the motherboard..

The way I applied thermal paste...

Pea size drop... actually smaller than a pea then spread it out with my finger in a plastic bag. Spread until the entire surface is covered in a VERY thin layer of thermal paste then apply heat sink.

My layer of thermal paste was EXTREMELY thin and after I booted up the pc the temps had dropped.. mind you only a few degrees. I guess my point is you don't need hardly any thermal paste at all to do the job.

In all honesty most methods are fine. Just don't use too much and get it on your mboard!
Again. Don't spread it. 3-5c is a big just for the TIM application.
Rice grain x2 on the center, press it down, done.
Edited by Tunagoblin - 8/6/11 at 8:08am
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