post #41 of 41

The problem will not be solved in the oven. You'll also be filling the room potentially with toxic gases. Baking only solves the issue of a BGA having a continuity issue. Baking basically "reflows" the BGA solder beads on their pads. This is/was a common issue with the Xbox 360 and PS3 as the CPU or GPU would separate from the PCB at the BGA solder pads. It's also the cause of RAM failure in a lot of instances. Shorted out components and damaged ICs cannot be repaired via baking like what's happened to your board from the static bag.

As a sideline I fixed Xbox 360s by reflowing the BGAs on them. Very time consuming and a brutal way to make money. I have a reflow workstation and it has thermal programs in it that have to be very accurate. ROHS components have to be soldered within very specific temps and they need to be ramped up in stages. Most dolts that try to do this with an oven overhead the components and damage them as an oven just isn't as accurate as a reflow workstation... Not to mention filling the room with toxic cancer causing fumes!


Yeah well it's not that bad if what he did there works... Sometime it doesn't and then you have to "re-ball" the BGA and you don't have this tool life sucks placing the TINY balls in each pad.

All that work for around a $100-150 bucks...
Edited by HiroPro - 8/22/11 at 6:49am
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Hal9000
(13 items)
 
  
CPUMotherboardGraphicsRAM
i5 2500K @ 4.2Ghz 1.325v in BIOS but 1.278 DMM Gigabyte P67A-UD5-B3 BIOS F5 HD 4890 Mushkin Blackline 996744 PC3-12800 8-8-8-24@1.58v 
Hard DriveOptical DriveOSMonitor
WD Caviar Black 1TB SH-203N Win 7 Ultimate X64 and Linux Mint LG 24" 16:10 
PowerCase
Corsair HX650 Lian Li PC-8FI 
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