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Homemade TIM 10-20C better? - Page 2

post #11 of 17
None of these suggestions or mixtures are as good as purpose made TIMs.

To have seen such an improvement the original TIM must have bled out and dried, leaving very little contact between the cooler and the CPU/GPU. Any replacement would likely have done at least as well.
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post #12 of 17
best results are from lapping both the cpu and hs and no TIM at all coz remember TIM is really just another layer of insulator compared to metal
post #13 of 17
Quote:
Originally Posted by hazarada View Post
best results are from lapping both the cpu and hs and no TIM at all coz remember TIM is really just another layer of insulator compared to metal
No. TIM is required as it helps transfer the heat... it is not an insulator(maybe crappy ones can be though)
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post #14 of 17
Quote:
Originally Posted by kill View Post
No. TIM is required as it helps transfer the heat... it is not an insulator(maybe crappy ones can be though)
The only reason why TIM is beneficial is because it fills the gaps otherwise occupied by air and usually the net effect is better despite having much worse thermal conductivity then copper for example. If you can smooth over sufficient amount of these gaps tho for direct contact between the cpu and HS the TIM becomes rather a hindrance then a beneficial element

as for it not being an insulator - the best TIMs have a thermal conductivity of 7-9 w/mk while copper is at 400 which is 44 times better at worst
post #15 of 17
Quote:
Originally Posted by hazarada View Post
The only reason why TIM is beneficial is because it fills the gaps otherwise occupied by air and usually the net effect is better despite having much worse thermal conductivity then copper for example. If you can smooth over sufficient amount of these gaps tho for direct contact between the cpu and HS the TIM becomes rather a hindrance then a beneficial element

as for it not being an insulator - the best TIMs have a thermal conductivity of 7-9 w/mk while copper is at 400 which is 44 times better at worst
Which is exactly why less is better with TIM. The M in W/mK is meters (a unit of distance). The thinner the TIM layer is the less it insulates the CPU. As you mentioned the only purpose of the TIM is to fill up the air gaps.

You basically just need enough to fill up the tiny imperfections in the metal surface, nothing more. There should be virtually nothing between the heatsink and the CPU heatspreader even with TIM present.

When you are talking about 0.0001 meters of TIM the thermal conductivity isn't that much if a bottleneck.
    
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post #16 of 17
Quote:
Originally Posted by Epitope View Post
You basically just need enough to fill up the tiny imperfections in the metal surface, nothing more.
which is harder then it sounds since the most popular "grain of rice" amount is over 100 times more then you need, yet you need that much for it to spread around sufficiently to get all the gaps. The rest of it just hangs out between the cpu and heatsink preventing patches that are otherwise aligned well enough from making direct contact. With proper lapping you can get the ihs/heatsink flat enough tho that the benefit from more direct contact outweighs filling the gaps
post #17 of 17
Quote:
Originally Posted by hazarada View Post
best results are from lapping both the cpu and hs and no TIM at all coz remember TIM is really just another layer of insulator compared to metal
Not practical to get, or keep, the surfaces completely flat and smooth, so in any real world situation, some amount of TIM is going to be beneficial.

Quote:
Originally Posted by hazarada View Post
which is harder then it sounds since the most popular "grain of rice" amount is over 100 times more then you need, yet you need that much for it to spread around sufficiently to get all the gaps. The rest of it just hangs out between the cpu and heatsink preventing patches that are otherwise aligned well enough from making direct contact. With proper lapping you can get the ihs/heatsink flat enough tho that the benefit from more direct contact outweighs filling the gaps
I've never seen nor heard of a situation where no TIM resulted in better results than a reasonable application.
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