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Remove CPU motherboard clamp = better temps!?

post #1 of 10
Thread Starter 
Not sure if this belongs here...
I have read from some that the CPU clamping retention bracket on the motherboard (mine is labelled "LOTES" on my Gigabyte P55-UD3P) applies so much force to the IHS that it flexes into an other-than perfectly flat plane. The problem is worse for those who have lapped their CPUs, since the thinner IHS bends more easily. This is evidenced by the uneven thermal paste distribution on the IHS upon uninstalling the CPU. Removing the clamp is supposed to give better contact between the IHS and heatsink/waterblock.

So...is it safe to remove the CPU retention clamp from the mainboard, and let the downward force of the heatsink/waterblock and its mounting hardware hold the CPU against the pins?

Of course, am asking because this is exactly what I did...lapped my 860, installed (with corsair H70) and P95 benched, removed and reinstalled with the clamp removed, and got ~1 deg C better under subsequent P95 bench.

But is this safe for 24/7 use?

Usin ShinEtsu x23-7783 paste, btw.
-tfoss
post #2 of 10
For ~1c of difference I'm not sure its really worth risking it shifting in the socket. If you running so hot that you NEED that 1c to run 24/7 you may want to look to other parts of your systems cooling for a change.
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post #3 of 10
It sounds safe, but a mere 1°C drop makes it sound like a waste of time to me. I mean, if you got a 10°C drop, or even 5°C degree drop, then yeah I would probably consider doing it to my system!

However, I have to wonder now: did you mean that it got "~ 10 deg C better"? Did you make a typo?
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post #4 of 10
It's plenty safe.

I remove the bracket when i mount my pot since it really just gets in the way.

You have to be careful when you take off whatever you are using to cool your CPU, so you don't lift up the CPU with it.

I would say it is total hogwash though that it bends the IHS
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post #5 of 10
i have the thermaltake frio cooler, and it is designed to be used without a clamp. Not sure how your cooler will fit without one tho.
http://fr.thermaltake.com/db/Editor/...564/amd/01.jpg
if you look a A,B,or C in the picture you can see the metal is raised to fit w/o a clamp
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post #6 of 10
Quote:
Originally Posted by PoNGxB View Post
i have the thermaltake frio cooler, and it is designed to be used without a clamp. Not sure how your cooler will fit without one tho.
http://fr.thermaltake.com/db/Editor/...564/amd/01.jpg
if you look a A,B,or C in the picture you can see the metal is raised to fit w/o a clamp
That's not why Thermaltake bent those parts into that shape.

To understand why they did it, try to imagine installing the Frio with those parts being perfectly straight as opposed to being bent like that.
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post #7 of 10
Quote:
Originally Posted by tfoss View Post
Not sure if this belongs here...
I have read from some that the CPU clamping retention bracket on the motherboard (mine is labelled "LOTES" on my Gigabyte P55-UD3P) applies so much force to the IHS that it flexes into an other-than perfectly flat plane. The problem is worse for those who have lapped their CPUs, since the thinner IHS bends more easily. This is evidenced by the uneven thermal paste distribution on the IHS upon uninstalling the CPU. Removing the clamp is supposed to give better contact between the IHS and heatsink/waterblock.

So...is it safe to remove the CPU retention clamp from the mainboard, and let the downward force of the heatsink/waterblock and its mounting hardware hold the CPU against the pins?

Of course, am asking because this is exactly what I did...lapped my 860, installed (with corsair H70) and P95 benched, removed and reinstalled with the clamp removed, and got ~1 deg C better under subsequent P95 bench.

But is this safe for 24/7 use?

Usin ShinEtsu x23-7783 paste, btw.
-tfoss
Doesn't sound right.

The clamp provides relatively even pressure around the edge of the IHS. There should not be much deformation.

Lapping does not take that much off the IHS.

A 1C difference is well within margins of error if you only tested it once.
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post #8 of 10
Quote:
Originally Posted by TwoCables View Post
That's not why Thermaltake bent those parts into that shape.

To understand why they did it, try to imagine installing the Frio with those parts being perfectly straight as opposed to being bent like that.
They could have easily changed the backplate and the way it screws in to make it flat, or just used really long screws. Who knows maybe that was the cheapest way of production.
Either way the point is, its fine as long as your HSF can hold it in place.
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post #9 of 10
sounds like you probably made it worst if it was allowed to cool down and then you only got 1 *C difference,

probably ambient , lol
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post #10 of 10
Nah the mounting clamp isn't putting that much pressure on the CPU. It would take a lot more than you're thinking to bend anything and I'm sure its designed so that either A) not all of the spring force is distributed to the CPU IHS or B) that the pressure is insufficient for bending. I know that spring feels really tight but its really not hard to throw it into some FEA analysis and check it out. These clamps have been in production for awhile too...

For heatsinks it is quite a bit different because those mount directly over the cores and push down as much as the heatsink design allows. The force being in the center leads to bending a lot more easily than the force being on the edges (since the CPU is supported on the edges).

As much as you'd like to think the 1C is from the mod, its can easily be due to your testing conditions (ambient, how long you ran the test, what test you ran, was your GPU warm at the time, and especially TIM application). 1C is negligible.

That being said I dunno if its unsafe, personally I wouldn't bother though. Just work on the TIM application or do some lapping on the heatsink.
    
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