Quote:
Ah, a voice of reason.Originally Posted by Jesse D 
I could be wrong, but so far all I have seen is a couple people that de-lided their chips and did not apply sufficient pressure to account for the lack of IHS. Basically that means nothing as the increased amount of TIM to bridge the gap puts us back to the same situation of two layers of TIM.
As I said I could be wrong, if you have a link to someone who properly applied a HS to the chip please post it.
I could be wrong, but so far all I have seen is a couple people that de-lided their chips and did not apply sufficient pressure to account for the lack of IHS. Basically that means nothing as the increased amount of TIM to bridge the gap puts us back to the same situation of two layers of TIM.
As I said I could be wrong, if you have a link to someone who properly applied a HS to the chip please post it.
First, there is no TIM that can replace the sandy bridge solder and maintain the same efficiencies in transmitting heat off the chip surface to the cooling system. So unless someone has actually applied solder to an IB chip properly, nobody has proven anything in comparison to what could be had with solder.
Second, maybe you can still improve the cooling by removing the Intel IHS TIM, but applying a heat sink directly to a de-lidded IB with the correct amount of pressure will likely require a custom made interface (with properly-spaced internal screws/mechanism designed to put an even pressure across the face of the chip) or shims of the exact same density of the chip. The mounting holes in motherboards are not properly spaced. Good luck.
As it is now, your passive external cooling systems can only extract as much heat as the IHS removes from the chip.
Roast beef, chicken, Ham, and Munster cheese.
Some of it's common knowledge for someone like you but it helped me tremendously.
