Originally Posted by Poisoner
Try cooling a Bloomfield and see what happens.
Originally Posted by ArcticZero
So I lapped my H50 last night. Here's some pics of the process:
From the moment I checked the base with a metal ruler and began lapping, it was pretty obvious the base was pretty concave. If I would stick the CPU to the base manually, the suction was pretty good. However once mounted on the mobo, it's like they barely stuck to each other at all.
This is after a few rotations at 800 grit. The X hasn't faded at all in the center.
After 800 grit
After 1200 grit
After 1500 grit
If I had some 2000 grit paper handy, then I could've gotten a better finish. But it's flat as can be now, which is what matters anyway.
Check how the TIM was spreading before I lapped it.
Just some pics of the mess
I also switched to using the LGA775 mounting holes as an experiment to see whether it would give me better pressure than the LGA1366 holes.
And now for temps!
Before: 52-56c idle, 80-85c load
Now: 44-50c idle, 74-77c load
If those seem high to you, it's because my ambients never go below 30c where I live. But that's good enough for me considering where I was before.
Because the H50's base is concave, and sort of loses contact toward the middle of a Bloomfield, which is a larger chip, and why the Sandy, a smaller chip gets better cooling.