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i7 with Noctua NH-D14 to hot? - Page 3

post #21 of 70
Do not spread the TIM across the CPU leave a dot or an small X pattern the put the heatsink on spreading a thin layer across the cpu causes heaps of air bubbles i used to do it till i saw this youtube video where they tested the tim methods and spreading it was the worst!

http://youtu.be/EyXLu1Ms-q4 <----- watch this and never spread again
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post #22 of 70
Quote:
Originally Posted by noob.deagle View Post
Do not spread the TIM across the CPU leave a dot or an small X pattern the put the heatsink on spreading a thin layer across the cpu causes heaps of air bubbles i used to do it till i saw this youtube video where they tested the tim methods and spreading it was the worst!

http://youtu.be/EyXLu1Ms-q4 <----- watch this and never spread again
That YT video is crap, the plastic is probably flexing letting in air.

Spread is by far the best method, you need a flat chip though.

How I know? Personal experience.
post #23 of 70
Thread Starter 
Im lost ;P
Ill redo it once more with 5mm dot in the middle and thats it. If its gonna be hot, screw it, no overclocking for me ;(
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post #24 of 70
Quote:
Originally Posted by Khaotik55 View Post
That YT video is crap, the plastic is probably flexing letting in air.

Spread is by far the best method, you need a flat chip though.

How I know? Personal experience.
when i moved from spread to the line pattern temps were better so......

i guess best idea is to just try it and see for op
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post #25 of 70
Quote:
Originally Posted by noob.deagle View Post
when i moved from spread to the line pattern temps were better so......

i guess best idea is to just try it and see for op
Was your CPU's IHS and heatsink lapped?

If no, well then... those results don't matter. As I said you need two very flat surfaces for the thin spread method to be effective.
post #26 of 70
Quote:
Originally Posted by Morit View Post
Im lost ;P
Ill redo it once more with 5mm dot in the middle and thats it. If its gonna be hot, screw it, no overclocking for me ;(
btw i have a nh-d14 your temps are about the same as what i'm getting with mine maybe a tad higher but thats probably down to case airflow differences i have a haf932.
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post #27 of 70
Quote:
Originally Posted by Khaotik55 View Post
Was your CPU's IHS and heatsink lapped?

If no, well then... those results don't matter. As I said you need two very flat surfaces for the thin spread method to be effective.
then why do you recommend that method to people who most likely would not have lapped their stuff.

so from this we can deduce if you have lapped your cpu ihs and heatsink then use spread for the 98%* of us who dont go lapping things just use dot or cross methods.



*made up percentage
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post #28 of 70
Can anyone provide a picture of the "right" size of NT-H1 to put on a 2600k or 2500k? I just got a NH-D14 and want to make sure I get it right the first time -- the rice comparison doesn't help me as much as a picture for visualization. Thanks!
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post #29 of 70
Quote:
Originally Posted by noob.deagle View Post
then why do you recommend that method to people who most likely would not have lapped their stuff.

so from this we can deduce if you have lapped your cpu ihs and heatsink then use spread for the 98%* of us who dont go lapping things just use dot or cross methods.



*made up percentage
Please tell me where I recommended to do the spread method dude.

Because if I recall correctly on the last post of page 2 I recommended the PROPER method for SB, line.
post #30 of 70
Thread Starter 
It is pretty cool inside the case. Two fans near the CPU plus three at the bottom putting air inside, makes me not belive in the case theory.. With open case the temps are higher..

Makes me think what would happen If I use the stock cooler if now the load temps gets to 70..

Ill put out motherboard tommorow and see if the beckplate is correct and redo it one last time with a line placed vertical on the processor.
Then Ill hang myself
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