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Apply thermal compound correctly

post #1 of 11
Thread Starter 
Hi,

I know there are lots of debates of how to apply it properly but I don't seem to find a good way to do it. Browsed through Youtube but wasn't really helpful. Maybe you can give me some advice.

thanks
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post #2 of 11
To be honest it varies with the type of heatsink you are using, also with the person you ask. For most, flat bottom, heatsinks, the small dot method in middle of the CPU seems to be the best way to go. BB to pea size.
post #3 of 11
I find a single line down the centre works best.
post #4 of 11
Quote:
Originally Posted by Chuckclc View Post
To be honest it varies with the type of heatsink you are using, also with the person you ask. For most, flat bottom, heatsinks, the small dot method in middle of the CPU seems to be the best way to go. BB to pea size.
This. For typical flat bottomed coolers, then the "dot method" is the best way to go (same with water cooling blocks usually).

If you're using a HDT cooler (such as a Xigmatek S1283 variant or CoolerMaster Hyper 212+ or similar), then you'll want lines in between the heatpipes....like this:

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post #5 of 11
Quote:
Originally Posted by Chuckclc View Post
To be honest it varies with the type of heatsink you are using, also with the person you ask. For most, flat bottom, heatsinks, the small dot method in middle of the CPU seems to be the best way to go. BB to pea size.
This is probably the best method.

I smear a very thin layer over the chip, but it's persomal preference.

Too much isn't necessarily a good thing!
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post #6 of 11
Quote:
Originally Posted by The Doc View Post
This is probably the best method.

I smear a very thin layer over the chip, but it's persomal preference.

Too much isn't necessarily a good thing!
Actually, with thermal interface material.....less is more. Obviously you have to use SOME.

And your "smear method" is generally not a good idea usually. You're more prone to introducing air bubbles between the two surfaces that way.
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post #7 of 11
Thread Starter 
I have Freezer XTREME Rev. 2 and the i5 2500k. I'm using the Syringe compound. Also what about air bubbles? They seem to be restricting airflow. I tried to smear the whole cpu and also the little dot in the middle and putting the cooler on top of it, but the temps are still high (35 @ idle and 75 @ stress out)
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post #8 of 11
Quote:
Originally Posted by chip_virus View Post
I have Freezer XTREME Rev. 2 and the i5 2500k. I'm using the Syringe compound. Also what about air bubbles? They seem to be restricting airflow. I tried to smear the whole cpu and also the little dot in the middle and putting the cooler on top of it, but the temps are still high (35 @ idle and 75 @ stress out)
That cooler is a flat base cooler, so you'll want to use the "dot method". It's only capable of getting rid of about 160w worth of power. You've got an old 90nm, incredibly hot running Pentium D.
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post #9 of 11
According to HardwareSecrets, for flat bottomed coolers do the small pea sized blob in the centre of the CPU. For Heatpipe Direct Touch coolers do a slightly larger blob in the centre of the CPU.

Here is the article with the results of several techniques.
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post #10 of 11
Quote:
Originally Posted by pioneerisloud View Post
Actually, with thermal interface material.....less is more. Obviously you have to use SOME.

And your "smear method" is generally not a good idea usually. You're more prone to introducing air bubbles between the two surfaces that way.
Correct... I should have explained better... I smear a thin film over the chip, then I 'twist' the cooler into place, thereby eliminating any chance of bubbles... which is why I would always recommend placing a pea sized lump of paste in the middle of the CPU and pressing down firmly. I use a thin film on the processor, but I know how to seat the cooler properly at this stage
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