|TSMC’s 28nm process offering includes 28nm High Performance (28HP), 28nm High Performance Low Power (28HPL), 28nm Low Power (28LP), and 28nm High Performance Mobile Computing (28HPM). Among these technology offerings, 28HP, 28HPL and 28LP are all in volume production and 28HPM will be ready for production by the end of this year. The production-version design collateral of 28HPM has been distributed to most mobile computing customers for their product-design use. The number of customer 28nm production tape outs has more than doubled as compared with that of 40nm. At 28nm, there are currently more than 80 customer product tape-outs. The TSMC 28nm process has surpassed the previous generation’s production ramps and product yield at the same point in time due to closer and earlier collaboration with customers. TSMC’s 28nm design ecosystem is available through its Open Innovation PlatformÂ®, with qualified EDA design tools and third-party IP ready for customer designs.|
Yields are good but there is more customer demand for 28nm, so probably not going to see parts out earlier than previously projected dates.