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[TechReport]A quick look at Bulldozer thread scheduling - Page 4

post #31 of 46
Quote:
Originally Posted by xlink View Post
AMD is basically back where they were in 1995... decent chip, but JUST a bit behind...
Well Intel was a bit behind in the mid 2000's, so cant count out AMD just yet.
post #32 of 46
Quote:
Originally Posted by Brutuz View Post
But the cache (The tiny 16KB of the L1 cache, or gigantic and slow L2 and L3 cache) are what would push the single core performance up, they seem to be pretty data starved as it is, we're definitely not seeing the BD pipeline at its fullest.
Very true, and bd-e(?) should hopefully fix this, but you can't expect an enormous gain from it. Significant, yes, but i wouldnt say it would put it much past PH II single-core performance, which would basically just make it a Thuban x8. (4.5-5ghz though which might actually be pretty cool)

Either way, once they have more die space to play around with, be it through optimizations, cutting down on unneccessary cache, die shrinks, or something else, i think we'll see a really killer arch.
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post #33 of 46
Well, if GloFo refines its 32nm process and AMD can drastically cut latencies, we might see a big performance jump.

Although as for now I'd already given the production to TSMC.
   
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post #34 of 46
Quote:
Originally Posted by Artikbot View Post
What you call your humble opinion has a crapload of sense.

When increasing NB speed all we do is bump the memory<->processor bandwidth and speed while keeping the same latency.

If that alone is a HUGE change (in PhII it was too), now cut latencies by a 25% and you get even faster links. Then a quadchannel IMC would make sense, and would skyrocket performance.
That wouldn't do anything for BD though, the NB clock does nothing for it as it is now.

The cache's latency is too high, not the speed.

Quote:
Originally Posted by Rommel View Post
Very true, and bd-e(?) should hopefully fix this, but you can't expect an enormous gain from it. Significant, yes, but i wouldnt say it would put it much past PH II single-core performance, which would basically just make it a Thuban x8. (4.5-5ghz though which might actually be pretty cool)

Either way, once they have more die space to play around with, be it through optimizations, cutting down on unneccessary cache, die shrinks, or something else, i think we'll see a really killer arch.
Yeah, it's up to GoFlo to fix their 32nm process, that's what's crippling BD as much as anything now.
The latency, (Cut L3 cache altogether, it does nearly nothing for desktop in AMDs own words and make L2 cache two separately accessed 1MB chunks per module rather than one 2MB chunk per module) the decoder (Even 6ops/cycle which would match Thuban when both cores are pegged), the size (Double the L1 cache to 32KB, or even quadruple it to 64KB) and fix the process. (Meaning it'll hit higher speeds, which is the point of BD).
    
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post #35 of 46
Quote:
Originally Posted by Chuckclc View Post
Well Intel was a bit behind in the mid 2000's, so cant count out AMD just yet.
Intel was behind in performance in the mid 2000's.
AMD is behind in performance, R&D budget, fabrication process, market cap, marketing, and market share today.

Quote:
Originally Posted by Artikbot View Post
Well, if GloFo refines its 32nm process and AMD can drastically cut latencies, we might see a big performance jump.

Although as for now I'd already given the production to TSMC.
Does TSMC have a SOI fab anymore?
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post #36 of 46
Do these TechReport guys have a habit of going easy on AMD? I remember another thing from them about Llano and how it was more forward looking than current and needs more maturing or some such business. Just wondering how many grains of salt to take with the article.
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post #37 of 46
Quote:
Originally Posted by DuckieHo View Post
Intel was behind in performance in the mid 2000's.
AMD is behind in performance, R&D budget, fabrication process, market cap, marketing, and market share today.
And we may never know how AMD would have been different if Intel did not pay off OEMs to ban AMD products in the early to mid 2000's.
post #38 of 46
Quote:
Originally Posted by Artikbot View Post
Well, if GloFo refines its 32nm process and AMD can drastically cut latencies, we might see a big performance jump.

Although as for now I'd already given the production to TSMC.
AMD might have already. AMD-TSMC I'm pretty sure GloFo dropped the ball on the manufacturing side of this Bulldozer failure, In my opinion BD uses way too much power at full load for a 32nm chip. So if AMD can fix the IMC, cache and improve the manufacturing BD might become a solid chip. Maybe will see these improvments in piledriver.
post #39 of 46
Quote:
Originally Posted by DuckieHo View Post
Does TSMC have a SOI fab anymore?
Rumors are they are manufacturing the Trinity APUs... I doubt they've completely ditched SOI though.

Edit: TSMC said on 2006 that they produced no significant volume of SOI wafers... Maybe they completely swapped to bulk-silicon and quit doing SOI anymore.

Chartered semi on the other hand is exclusively using SOI fabs.


So, there goes the rumors. Trinity will be manufactured by GloFo, yes or yes.
Edited by Artikbot - 10/31/11 at 4:50am
   
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post #40 of 46
Quote:
Originally Posted by DuckieHo View Post
Intel was behind in performance in the mid 2000's.
AMD is behind in performance, R&D budget, fabrication process, market cap, marketing, and market share today.
Does TSMC have a SOI fab anymore?
Quote:
In a bid to offer the most advanced fabrication process technology among contract semiconductor manufacturers, Taiwan Semiconductor Manufacturing Company has decided to skip development of 22nm manufacturing process and move straight to 20nm process technology already in the second half of 2012 with risk production, which results into volume manufacturing in 2013.

During his address to nearly 1.5 thousand TSMC customers and third party alliances, Dr. Shang-yi Chiang, TSMC senior vice president of research and development, said that the move to 20nm creates a superior gate density and chip performance to cost ratio than a 22nm process technology and makes it a more viable platform for advanced technology designers. He also announced that TSMC is expected to enter 20nm risk production in the second half of 2012. Dr. Chiang also indicated that the company has demonstrated record-setting feasibility of other transistor structures such as FinFET and high-mobility devices.

TSMC recently decided to cancel development of 32nm manufacturing process and develop 28nm HKMG fabrication technology instead. Even though the move is projected to improve the company’s competitive position in 2011, the decision comes after the company failed to deliver sufficient production yields with 40nm process technology, which was designed after TSMC decided to skip 45nm production tech.
source (xbit 13 April 2010)

TSMC cut development on 32nm. I think that they will mostly invest in half-nodes in the future.
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