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[Official] NVIDIA GPU Mod Club - AKA "The Mod" - Page 307

post #3061 of 8609
Quote:
Originally Posted by {EAC} Shoot em UP View Post

I'm not an expert on this or anything, but I would say it should be same exact thing. All the thermal paste is trying to do is create an environment where there is 100% surface to surface contact. It would be ideal to not use any at all, but seeing as neither surface is perfectly flat or smooth, we gata do something. So I mean as long as you can cover the entire area that is to be covered with as little as possible, you should be perfect, air cooler or cold plate.

Exactly. TIM only fills those microscopic gaps in between the die and the heatsink. The thing is how does the pressure from these cold plates affect the spreading of the paste when mounted? This dictates what would be the best method to use for application.
post #3062 of 8609
Sorry for double post.
post #3063 of 8609
Quote:
Originally Posted by kevindd992002 View Post

Sorry for double post.

O, I misunderstood your question. So you mean the applied pressure the mounting hardware puts on the plate to die surfaces? Im thinking it would be the same as any air cooler I have ever used... I always use the rice method on my CPU's, and I figure this should also work seeing as I don't know why the pressure would be any different here. The die is a hell of a lot smaller, but in theory I don't see why it would be any different.
post #3064 of 8609
Quote:
Originally Posted by {EAC} Shoot em UP View Post

O, I misunderstood your question. So you mean the applied pressure the mounting hardware puts on the plate to die surfaces? Im thinking it would be the same as any air cooler I have ever used... I always use the rice method on my CPU's, and I figure this should also work seeing as I don't know why the pressure would be any different here. The die is a hell of a lot smaller, but in theory I don't see why it would be any different.

Yup. The rice/pea method actually works better for CPUs with IHS. I do the same thing.

But for GPU bare dies it would be better if the whole surface of the die is coated with a thin film of paste.
post #3065 of 8609
Quote:
Originally Posted by kevindd992002 View Post

Yup. The rice/pea method actually works better for CPUs with IHS. I do the same thing.

But for GPU bare dies it would be better if the whole surface of the die is coated with a thin film of paste.

Thats what I was about to actually say, but the only issue I see with that is if the layer isn't the same thickness throughout it would cause an issue, but I mean I guess the pressure from the mounting hardware would make it so it was homogeneous throughout. Just make sure you using non-conductive TIM so if it isn't uniform and some bleeds out it doesn't hurt anything.
post #3066 of 8609
Quote:
Originally Posted by estabya View Post

Yeah I'm sure I can make it work thumb.gif I'm pretty stoked. Can't wait for everything to get here so I can do some crazy OCing.

I top out at 1280, gonna do the mod so I can try the unlocked voltage trick since my 670 FTW seems to teeter pretty close to the throttle mark without the mod
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Intel I7 4930K @ 4.6ghz ASUS Rampage IV Extreme EVGA GTX 970 EVGA GTX 970 
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Antec Kuhler 650 ThermalRight True Spirit 140 Power Windows 10 Ultimate 64 bit Samsung 240 HD TOC 
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SKYnet
(17 items)
 
  
CPUMotherboardGraphicsGraphics
Intel I7 4930K @ 4.6ghz ASUS Rampage IV Extreme EVGA GTX 970 EVGA GTX 970 
RAMHard DriveHard DriveOptical Drive
G. Skill Ripjaws X 4x4gb 1.5tb WD Caviar Green SATA Samsung 840 EVO 250gb SSD HP USB DVD 
CoolingCoolingOSMonitor
Antec Kuhler 650 ThermalRight True Spirit 140 Power Windows 10 Ultimate 64 bit Samsung 240 HD TOC 
KeyboardPowerCaseMouse
Razor Lycosa PC Power and Cooling Silencer 910 NZXT Switch 810 Matte Black It clicks.............. 
Mouse Pad
IKEA $1 pad 
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Reply
post #3067 of 8609
Quote:
Originally Posted by {EAC} Shoot em UP View Post

Thats what I was about to actually say, but the only issue I see with that is if the layer isn't the same thickness throughout it would cause an issue, but I mean I guess the pressure from the mounting hardware would make it so it was homogeneous throughout. Just make sure you using non-conductive TIM so if it isn't uniform and some bleeds out it doesn't hurt anything.

You mean for the pea method, the bare die will still be covered all throughout?
post #3068 of 8609
Quote:
Originally Posted by kevindd992002 View Post

You mean for the pea method, the bare die will still be covered all throughout?

Yes, I always do a little blob in the center. Rice grain, pea method, whatever u wanna call it. it won't be homogeneous because the surface isn't completely the same, you wouldn't want it to be homogeneous...It should fill the gaps that it needs to fill, call it what you want. Best result would be to lapp the cooler surface with just more than sand paper, having some sort of lapping machine that will create a perfectly flat smooth surface would grant you best results. Even lapping with 2000gritt sand paper will give you some surface deviation that the paste will be required... I always lapp my coolers. Especially the antec units. They need it BAD! The cooler surfaces are SOOO concave! SOO concave!
post #3069 of 8609
I need a case that can fit four 120mm rads for quad-SLI, plus standard air flow fans... suggestions?
post #3070 of 8609
Well boys, I got my 2 Antec 620's now (one for EVGA 560Ti DS SC and the other for my cpu). Just waiting on the TIM (AS5) and Dwoods bracket. biggrin.gif
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