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Intel X79: Why are DIMM slots on both sides of CPU?

post #1 of 8
Thread Starter 
Does anyone know why they split up the RAM slots around the CPU socket on the new chipset? Is there not enough room on the PCB to fit all of the traces from 8 DIMM slots in a row? Or perhaps the propagation delay due to the difference in length of the traces would be problematic? But even on boards with only 4 DIMM slots they are still split up around the CPU...

It just seems like it would cause some clearance issues with aftermarket coolers and make things more cramped than they already are.
    
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post #2 of 8
I do believe that they cannot fit all of the traces on the PCB board itself. That's the understanding that I have at least. When I built my X79 system I just purchased the H80 and had no clearance issues at all. You really only get clearance issues with air coolers.
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post #3 of 8
no same amount of traces, its DDR3 lol, its not DDR4 or something.

The reason is because of trace parasitics and how speeds work. With DIMMs on both sides it allows for: #1 8-DIMMs #2 quad channel to run at 1600mhz as par with Intel spec which was raised from previous generations #3 much better signal integrity to OC in quad channel. i believe if you double the trace distance you double the resistance as well.
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post #4 of 8
Not enough space on the PCB I think.
post #5 of 8
Quote:
Originally Posted by Sin0822 View Post

no same amount of traces, its DDR3 lol, its not DDR4 or something.
The reason is because of trace parasitics and how speeds work. With DIMMs on both sides it allows for: #1 8-DIMMs #2 quad channel to run at 1600mhz as par with Intel spec which was raised from previous generations #3 much better signal integrity to OC in quad channel. i believe if you double the trace distance you double the resistance as well.

Agreed.
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post #6 of 8
Intel did it for latency and electrical quality reasons.
post #7 of 8
Quote:
Originally Posted by Sin0822 View Post

no same amount of traces, its DDR3 lol, its not DDR4 or something.
The reason is because of trace parasitics and how speeds work. With DIMMs on both sides it allows for: #1 8-DIMMs #2 quad channel to run at 1600mhz as par with Intel spec which was raised from previous generations #3 much better signal integrity to OC in quad channel. i believe if you double the trace distance you double the resistance as well.

Yes this is the reason. Less distance, the less time for data to travel. Everything has to be on a 1 : 1 ratio for perfect quality
post #8 of 8
Thread Starter 
Quote:
Originally Posted by Sin0822 View Post

no same amount of traces, its DDR3 lol, its not DDR4 or something.
The reason is because of trace parasitics and how speeds work. With DIMMs on both sides it allows for: #1 8-DIMMs #2 quad channel to run at 1600mhz as par with Intel spec which was raised from previous generations #3 much better signal integrity to OC in quad channel. i believe if you double the trace distance you double the resistance as well.

I meant since there are 8 DIMMs on these boards, rather than 6 on the previous generation, more traces will be needed for the 2 additional DIMMs. But these all reasons do makes sense.. I was wondering if it was just a combination of factors relating to the distance and maximum density of the traces or if intel was trying to do something 'innovative.'

Also you are correct, resistance increases linearly with distance!
    
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