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Dot or spread?

post #1 of 10
Thread Starter 
Hey all,

Is the "dot" method, or the "spread" method better when applying AS5 to the CPU IHS on an E6400?

Thanks
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Flux
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post #2 of 10
Dab and press FTW

dot
    
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post #3 of 10
i have NEVER used nor trusted the dot method. I spead a nice thin even coat with a razorblade
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post #4 of 10
Here is my opinion on the whole method mystery. I use a dot on IHSs and spread on an open die. So far this has worked %100 for me.
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post #5 of 10
Quote:
Originally Posted by ThaWaxShop
i have NEVER used nor trusted the dot method. I spead a nice thin even coat with a razorblade
Ick, you can get air bubbles this way
    
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post #6 of 10
really now. Never had one hmmm
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post #7 of 10
I had better results with the spread method. My IHS and HSF were lapped though, that might make a difference.
post #8 of 10
Quote:
Originally Posted by mycomputersucks
Here is my opinion on the whole method mystery. I use a dot on IHSs and spread on open an open die. So far this has worked %100 for me.
Totally agreed
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post #9 of 10
Quote:
Originally Posted by ThaWaxShop
really now. Never had one hmmm

How can you tell? lol.


Personally, I like the dot method for putting it on an IHS....but I did spread with a razorblade this time putting it directly on the die....and I ilked this way better...hard to compare temps though...cause I lapped the heatsink....
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post #10 of 10
Thread Starter 
Quote:
Originally Posted by RyGuy
I had better results with the spread method. My IHS and HSF were lapped though, that might make a difference.
RyGuy, ironically it is your comment posted on my lapping log post that prompted me to ask this question.

I used the spread method (shown in pic on that post) it as really, really thin. Then I took a look at some images of a naked e6400 to see the size of the die. This got me thinking.... maybe dot?

The results so far are awesome (down 6-10C - approx). I'm not really happy with the HSF orientation (another question thread) so I'm going to change it.

Thanks for all the replies.
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Flux
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