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Thermal goo

post #1 of 7
Thread Starter 
Just looking for some opinions on thermal compounds (on a water block)

I know arctic silver 5 is very popular (what im using now) but just curious if anyone else has some opinions on something better.
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post #2 of 7
Everything you wanted to know about thermal compounds and then some:

http://www.hardwaresecrets.com/article/Thermal-Compound-Roundup-February-2012/1490
post #3 of 7
Thread Starter 
thanks interesting stuff
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post #4 of 7
Now, that isn't a definitive be-all, end-all testing of thermal pastes. Though it does give you a good jumping off point. Of note, one of the most interesting results was that Mayonnaise is actually a better thermal conductor than about half of the thermal pastes that are out there.

My personal favorite (that I've used) is Phobya HeGrease Extreme, because I've found that it does a better job under high load than either Arctic Silver 5 or Arctic Ceramique, among others.
post #5 of 7
There are so many different opinions on this, and different fan clubs for this or that TIM. My concern has always been proper application. Here is a video I found that helped me decide how to apply TIM properly. YMMV...

How Thermal Compound Spreads-1
How Thermal Compound Spreads-2

[EDIT: update the link]
Edited by PhilC2001 - 2/19/12 at 7:23am
post #6 of 7
12 grams of MX-4... no cure time..easy clean up..works good..I'm hooked.Almost out,though sad-smiley-002.gif
..with about 4 mountings coming up..eh..have to run through the backup stuff :lachen.gif:
 
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Thuban Powah!
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post #7 of 7
Numerous TIM tests show that any of the top ~25+ TIMs will produce virtually identical results within 1-2C so use whatever makes you happy.

Apply the thinnest layer possible for best results - typically an almost translucent film ~.003" thick or less is best. TIM is only intended to fill the MICRO PORES in the heatsink and CPU heat spreader. This would be machining marks, scratches and minute low spots. You definitely do not want a thick paste between the CPU and heatsink as TIM is an insulator compared to metal-to-metal contact.

http://www.tomshardware.com/forum/268354-29-thermal-compound-roundup-2011
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