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What is the best way to apply Prolimatech PK-1?

post #1 of 11
Thread Starter 
I have a 960T CPU and an EVO HSF (CDC) and I would like to know what is the recommended way to apply the Prolimatech PK-1 (1gram BTW) on the CPU and HS and also what method do you apply?

Prolimatech's website FAQ recommends to 'please spread out evenly a thin layer of PK-1 onto the whole CPU and to the whole heatsink base bottom.'

Based on their recommendation I assume the following method is appropriate:
Quote:
To apply; simply heat the tube by running under hot water from the tap. Wipe it dry.
Get the thinnest plastic bag you can find (freezer bags are ideal), and cover your hand.
Apply a rice-grain size of the warm paste to the centre of the CPU heat spreader. Holding the CPU in one hand, GENTLY rub the paste using a circular motion, across the surface with your index finger (through the plastic bag). Just use VERY light pressure and massage it in until the surface is covered completely.
After rubbing for about 15 seconds, the heat from your finger softens the paste and eventually, it leaves behind a nice thin haze on the heat spreader.
Wait one minute and repeated the process to get a slightly thicker coat and then do the same thing to the bottom of the heat sink.

There are other methods I can try like dot, line or x-method.
http://www.youtube.com/watch?v=EyXLu1Ms-q4&noredirect=1
post #2 of 11
Those instructions are unusual, and not really in line with conventional wisdom regarding tim application. Prolimatech isn't exactly a bunch of amateurs when it comes to cpu cooling, though, so maybe they know something about their paste that we don't. I would still do the dot in the center method. Seemed to work out well in this test of Prolimatech.
    
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post #3 of 11
Not sure how thick it is compared to Arctic Silver 5 but I can't spread AS5 with a plastic bag. I just use an old gift card and smooth a blob over the CPU and call it a day. Never had a problem yet.
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post #4 of 11
Quote:
Originally Posted by Stealth3si View Post

I have a 960T CPU and an EVO HSF (CDC) and I would like to know what is the recommended way to apply the Prolimatech PK-1 (1gram BTW) on the CPU and HS and also what method do you apply?
Prolimatech's website FAQ recommends to 'please spread out evenly a thin layer of PK-1 onto the whole CPU and to the whole heatsink base bottom.'
Based on their recommendation I assume the following method is appropriate:
Quote:
To apply; simply heat the tube by running under hot water from the tap. Wipe it dry.
Get the thinnest plastic bag you can find (freezer bags are ideal), and cover your hand.
Apply a rice-grain size of the warm paste to the centre of the CPU heat spreader. Holding the CPU in one hand, GENTLY rub the paste using a circular motion, across the surface with your index finger (through the plastic bag). Just use VERY light pressure and massage it in until the surface is covered completely.
After rubbing for about 15 seconds, the heat from your finger softens the paste and eventually, it leaves behind a nice thin haze on the heat spreader.
Wait one minute and repeated the process to get a slightly thicker coat and then do the same thing to the bottom of the heat sink.
There are other methods I can try like dot, line or x-method.
http://www.youtube.com/watch?v=EyXLu1Ms-q4&noredirect=1

That reminds me of the old AS application guide (for CPUs without IHS). I've had the most performance using the pea method, no air bubbles.
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post #5 of 11
I've been using the dot method with mine, the spread is pretty reasonable. I'd be fine with that, but I suppose x-method might work, but may use more paste, at least it would if I was the one doing it.
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post #6 of 11
You shouldn't use anything to spread the paste as you will create air bubbles. Just allow the pressure of the heatsink to spread it
post #7 of 11
Quote:
Originally Posted by tw33k View Post

You shouldn't use anything to spread the paste as you will create air bubbles. Just allow the pressure of the heatsink to spread it

this... can't get the reasoning behind spreading...
post #8 of 11
Thread Starter 
I don't disagree with any of ya'll. I think I might try both ways, somewhat...

Because i emailed Prolimatech Tech support and they said:
Quote:
Dear sir,

After checking with our engineers about the spread application method, our engineers suggest to apply PK-1 to evenly a layer which is not thin (vaguely seen).
We've modified our website's FAQ (from a thin layer to a layer).
Since PK-1's thermal conductivity is very good (http://www.prolimatech.com/en/products/detail.asp?id=163&subid=1528#showtab), our engineers suggest to apply a layer on both CPU and heatsink which will have better performance.
If you like, you may apply a thick layer; however, a normal vaguely layer is enough. (thick layer means waste of the thermal compound)

About your question of spread application method may introduce the possibility of air bubbles, our engineers' reply as follows:
We've tried both ways (a dot in the center and spread it on both CPU and Heatsink) and found both ways have similar performance.

Best regards,


**************************************
Selena Lee
Prolimatech Co.,LTD.
E-mail:*************
Visit our Website at: www.prolimatech.com
Facebook: http://www.facebook.com/pages/Prolimatech-Co-LTD/143936609425
Twitter: https://twitter.com/#!/Prolimatech

****************************************

Now I suspect that they prefer the spread application maybe because they want us to buy more of them in the future?? I don't know.

I guess I would try spreading a thin layer on the heatsink and next removing the entire layer but leave a translucent haze that covers the microscopic holes and then applying the dot method on the CPU (or X method to cover more area if I have enough paste remaining.)
post #9 of 11
Quote:
Originally Posted by Stealth3si View Post

Now I suspect that they prefer the spread application maybe because they want us to buy more of them in the future?? I don't know.
I guess I would try spreading a thin layer on the heatsink and next removing the entire layer but leave a translucent haze that covers the microscopic holes and then applying the dot method on the CPU (or X method to cover more area if I have enough paste remaining.)

If they wanted people to buy more of it, it probably wouldn't be in their best interest to suggest a method that didn't perform well. Then people wouldnt buy it again.

The method you described is good, too. Spread a thin layer, or just put a dab on both cpu and heatsink, spread it around then wipe it off so there is a haze to fill in the imperfections. Seen it suggested before. I think people call it "prepping" the surface or something. Then do the drop method on cpu. Makes sense.
    
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post #10 of 11
Thread Starter 
Quote:
Originally Posted by Otterclock View Post

If they wanted people to buy more of it, it probably wouldn't be in their best interest to suggest a method that didn't perform well. Then people wouldnt buy it again.
I agree.

But she said both methods they tried gave similar performance. So either way it performs relatively well. I would say the main difference is the amount used.
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