I've just installed it, so I will take a pic of it inside the case later today.
I checked the heatsinks after 5 hours and they still seemed a little loose. One of them fell off when I held the pcb upside down, but I managed to stick it back on, and another 5 hours later it is still holding. I'm a little concerned however that it won't take much to dislodge them. I'm assuming the thermal glue bond will become stronger over time rather than weaker ...? I have some Sekisui thermal adhesive tape on the way so I will have to consider whether to replace the glue with this at some point.
So far initial idle temperature is 19c (ambient 16c) which is very impressive. I will do a few loops of heaven and test load temps. Noise is minimal to zero. At 30% there is a tiny bit of noise and I'm not sure whether I'm hearing the cooler or the case fans. At max 85% the fans are clearly audible but quite acceptable, although I would not leave them this way permanently (my goal is complete silence). Compared to the Gigabyte Windforce 680 OC I have for comparison, the noise at both idle and load is much lower (although the latter is also very quiet, but suffers from a 40% minimum fan speed).
More to follow.
Edit: Load temperatures in Heaven are around 53-55c most of the time peaking at 57c - similar to the windforce cooler. However, the Arctic fans never go over 35% while the Gigabyte fans go to about 45%. It certainly beats the reference cooler at 79-80c and 55% fan noise. It also gives a better overclock at the same offset of +160mhz. With the stock cooler it would peak at 1270Mhz but at the same offset I am now getting 1285.
Edited by rossb - 5/14/12 at 2:39pm