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post #21 of 31
Quote:
Originally Posted by AMD4ME View Post

No electro migration is due to voltage NOT temp. Temp most definitely affects CPU stability. Anyone who has OC'ed a Phenom II can tell you 60C is the typical temp where errors occur and folks tend to keep the max temp below 55C to prevent BSODs, etc.

You are absolutely wrong. Electormigration depends on current density quadratically, but on temperature exponentially. It has a stronger dependence on temperature than voltage, There is an empirically derived electromigration equation that relates mean time to failure of electronics to current density and temperature called Blacks equation that is accepted and used in the industry - you can see for yourself:

http://en.wikipedia.org/wiki/Black%27s_equation

Like I said, you can run stable at up to really high temps, but not at too low of a voltage.
Edited by GeneO - 4/2/12 at 10:20am
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post #22 of 31
Quote:
Originally Posted by AMD4ME View Post

The voltage/current is what causes metal migration. It's an electrical process not a thermal process. If you run the temp any where close to it's designed operating temp. it will run ten people lifetimes before you'd notice any metal migration.

It depends on temperature because the ions in the metal lattice, when thermally excited, are less bound to the lattice and can more easily be knocked out by the electron current. The hotter it is, the more excited the ions, and the easier it because to dislodge them.
Edited by GeneO - 4/2/12 at 10:26am
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post #23 of 31
Thread Starter 
Well Stress testing in cool in environments is not gonna make your overclock any less stable it will just force you to keep a hawk's eye on temp's when your environment returns to normal.

Example: Let's say its a hotter than average day and my CPU is just idling it is going to be idling a little hot but nonetheless still within an acceptable temperature range. Let us also say on said day I fire up Starcraft 2 In the settings it lists which settings are GPU extensive and which one are CPU extensive instead of trying to underclock back to a better temperature just drop the CPU extensive settings all the way down your game might not look as sexy but it is way faster than trying to re clock your system, and if your temps do hit to high of a temperature well then it's a nice day go out and ride a bike or something.thumb.gif
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post #24 of 31
Quote:
Originally Posted by GeneO View Post

It depends on temperature because the ions in the metal lattice, when thermally excited, are less bound to the lattice and can more easily be knocked out by the electron current. The hotter it is, the more excited the ions, and the easier it because to dislodge them.

Yes if you were trying to run your CPU @ 200C then temp. might be a valid issue in regards to accelerating metal migration but there is a problem... CPUs generally shut down long before any thermal damage is done let alone metal migration. wink.gif IME it's simply not an issue when stress testing.

When was the last time you heard of someone's CPU failing during stress testing from running at the 24/7 approved temp. for the CPU? I've never heard of it and never experienced it in 20+ years of building and testing highend PCs. You're worrying about a non-issue.
Edited by AMD4ME - 4/2/12 at 11:36am
post #25 of 31
Quote:
Originally Posted by AMD4ME View Post

The voltage/current is what causes metal migration. It's an electrical process not a thermal process. If you run the temp any where close to it's designed operating temp. it will run ten people lifetimes before you'd notice any metal migration.

This is not correct.

Temperature does have an influence on electromigration just as it has an influence on resistance.

http://www.csl.mete.metu.edu.tr/Electromigration/emig.htm

http://en.wikipedia.org/wiki/Electromigration#Thermal_effects

Temperature has a significant effect on electromigration at any temp range higher than that at which the metal becomes a superconductor; unless you are running very near absolute zero, temperature is influencing electromigration in copper.
Quote:
Originally Posted by AMD4ME View Post

Yes if you were trying to run your CPU @ 200C then temp. might be a valid issue in regards to accelerating metal migration but there is a problem... CPUs generally shut down long before any thermal damage is done let alone metal migration. wink.gif IME it's simply not an issue when stress testing.
When was the last time you heard of someone's CPU failing during stress testing from running at the 24/7 approved temp. for the CPU? I've never heard of it and never experienced it in 20+ years of building and testing highend PCs. You're worrying about a non-issue.

Most CPU failures are caused by electromigration and electromigration is happening, on some level, almost anytime the part is powered on.

I have had CPUs fail at low temps, while operating within specificed clocks and voltages. It's rare, but it does happen.

It happens much more quickly at high temps, high current loads, and high voltage, but can still take years.

He's not worrying about a non-issue. Higher temps lead to failure sooner, and stress testing is most certainly a cause of wear and tear. It's still necessary if you want to have

Indeed every 10C increase in temp roughly halves component lifetime. A CPU running at 50C is likely to last nearly eight times as long as one running at 80C.

http://en.wikipedia.org/wiki/Arrhenius_equation

http://en.wikipedia.org/wiki/Black's_equation
Quote:
Originally Posted by UndyingEcho View Post

Well Stress testing in cool in environments is not gonna make your overclock any less stable it will just force you to keep a hawk's eye on temp's when your environment returns to normal.
Example: Let's say its a hotter than average day and my CPU is just idling it is going to be idling a little hot but nonetheless still within an acceptable temperature range. Let us also say on said day I fire up Starcraft 2 In the settings it lists which settings are GPU extensive and which one are CPU extensive instead of trying to underclock back to a better temperature just drop the CPU extensive settings all the way down your game might not look as sexy but it is way faster than trying to re clock your system, and if your temps do hit to high of a temperature well then it's a nice day go out and ride a bike or something.thumb.gif

There is no hard line between stability and instability because instability is probabilistic. The point of stress testing isn't to make you feel better about a hastily done, marginally stable OC, it's to put the hardware through it's paces, executing as many instructions as possible in the shortest period of time possible, in situations where instability is most likely to be revealed. Why? Because if there is any potential for instability at all, you are testing every time an instruction is executed, every time a transistor switches, no matter what you are doing. You want errors to occur as little as possible, and if they are going to occur you want to force them to occur during your test so that you can detect them and fix whatever is causing them.

Also, just because I'm not at my computer doesn't mean it's not working. A particularly long encode job can take days, both my CPU and GPU have worked on distributed computing programs for months on end with no interruptions, often while I was away doing something and not in a position to babysit the system.

Also, heat doesn't imply a nice day. I'm currently in the south and triple digit F ambients with high 90s% humidity are not uncommon.
Edited by Blameless - 4/2/12 at 3:48pm
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post #26 of 31
Quote:
Originally Posted by AMD4ME View Post

Yes if you were trying to run your CPU @ 200C then temp. might be a valid issue in regards to accelerating metal migration but there is a problem... CPUs generally shut down long before any thermal damage is done let alone metal migration. wink.gif IME it's simply not an issue when stress testing.
When was the last time you heard of someone's CPU failing during stress testing from running at the 24/7 approved temp. for the CPU? I've never heard of it and never experienced it in 20+ years of building and testing highend PCs. You're worrying about a non-issue.

I am sorry but now you have gone from not believing electromigration depends on temperature to being an expert on it? No offense, but I think you are seriously underestimating the effects of electromigration and especially its dependence on temperature. This is why it is important to keep temperatures under control - not for stability.

If I plug in the numbers for Copper in Black's formula, and change the temperature from 50c to 70c, the mean time to failure is reduced by 82%. Less than 1/4 of the lifetime at 50c. Assuming a quadratic dependency on the current density (voltage) a change from 1.2 to 1.4V only reduces the lifetime by about 25% - 3/4 the lifetime at 1.2V.

Also, the impact of electromigration increase as die sizes decrease. Electromigration didn't used to be that big of a problem 20 years ago,. In fact aluminum was used for traces. More recently, because of the shrinkage in dies sizes and increased current density, copper had to be used instead of aluminum to get an acceptable mean time to failure.

Yes, if you run at a decent temperature and voltage, your processor will last a long time. But electomigration is a cumulative effect, so if you spend a lot of time benching at high temp and voltage, you can shorten the lifetime significantly.
Edited by GeneO - 4/2/12 at 3:57pm
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post #27 of 31
Looks like it has been mentioned already but eventually heat will contribute to instability. I saw this with my 1100t when going over 4.2ghz. More voltage didn't help, once I got into the 55c range it would lock up. Getting load temps in the 40s with cooling made the difference. So with your concept you may achieve stability but only at that temp.

Edit:
Basically for 24/7 stability, stability should be achieved with conditions that the pc will see.
Edited by 66racer - 4/2/12 at 3:50pm
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post #28 of 31
Quote:
Originally Posted by GeneO View Post

This is why it is important to keep temperatures under control - not for stability.

It's for both. You are just as wrong as AMD4ME if you believe that temperature doesn't frequently have a significant impact on stability.

Anyone with much experience with the issue can tell you that high temps can compromise stability and low temps improve it.
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post #29 of 31
Quote:
Originally Posted by Blameless View Post

It's for both. You are just as wrong as AMD4ME if you believe that temperature doesn't frequently have a significant impact on stability.
Anyone with much experience with the issue can tell you that high temps can compromise stability and low temps improve it.

Yes, you are probably right for high to extreme overclocking. I expect that the main effect would be due to the noise from thermal fluctuations.
Edited by GeneO - 4/2/12 at 4:08pm
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post #30 of 31
Thread Starter 
Quote:
Originally Posted by Blameless View Post

This is not correct.
Temperature does have an influence on electromigration just as it has an influence on resistance.
http://www.csl.mete.metu.edu.tr/Electromigration/emig.htm
http://en.wikipedia.org/wiki/Electromigration#Thermal_effects
Temperature has a significant effect on electromigration at any temp range higher than that at which the metal becomes a superconductor; unless you are running very near absolute zero, temperature is influencing electromigration in copper.
Most CPU failures are caused by electromigration and electromigration is happening, on some level, almost anytime the part is powered on.
I have had CPUs fail at low temps, while operating within specificed clocks and voltages. It's rare, but it does happen.
It happens much more quickly at high temps, high current loads, and high voltage, but can still take years.
He's not worrying about a non-issue. Higher temps lead to failure sooner, and stress testing is most certainly a cause of wear and tear. It's still necessary if you want to have
Indeed every 10C increase in temp roughly halves component lifetime. A CPU running at 50C is likely to last nearly eight times as long as one running at 80C.
http://en.wikipedia.org/wiki/Arrhenius_equation
http://en.wikipedia.org/wiki/Black's_equation
There is no hard line between stability and instability because instability is probabilistic. The point of stress testing isn't to make you feel better about a hastily done, marginally stable OC, it's to put the hardware through it's paces, executing as many instructions as possible in the shortest period of time possible, in situations where instability is most likely to be revealed. Why? Because if there is any potential for instability at all, you are testing every time an instruction is executed, every time a transistor switches, no matter what you are doing. You want errors to occur as little as possible, and if they are going to occur you want to force them to occur during your test so that you can detect them and fix whatever is causing them.
Also, just because I'm not at my computer doesn't mean it's not working. A particularly long encode job can take days, both my CPU and GPU have worked on distributed computing programs for months on end with no interruptions, often while I was away doing something and not in a position to babysit the system.
Also, heat doesn't imply a nice day. I'm currently in the south and triple digit F ambients with high 90s% humidity are not uncommon.

Well yes under those circumstances it would be a bad idea but I overclock just for fun, 90% of the time my CPU is at 0% in my task manager even typing this post out right now its spiking to 2% max so right now even if it got 120 F in here my CPU is not gonna overheat at 2-5% load unless I am stability testing in the arctic circle on 5-6Ghz clock speeds. I'm just saying for someone who isn't maxing their CPU on a regular basis, this should be more than acceptable for stability testing a normally unrealistic overclock.
The Lady Getter
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The Lady Getter
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Intel Core 2 Duo E7300 P5Q NVIDIA GeForce GTX 460 G.Skill 
Hard DriveCoolingOSMonitor
Seagate Barracuda 6 Fans WIndows 7 Home Premium 64-bit Insignia something or other 
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Logitech OCZ Fatality 550W Ultra Razer Naga 
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