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More Ivy Bridge benchmarks - Sandybridge comparison - 3770K vs 2600K (Performance, temps etc) "Couple Of LN2 scores are up" - Page 54

post #531 of 690
I know its in german, but a reasonably low voltage 4.5Ghz 3570K. 1.188V on air with low 60's on prime.
http://www.computerbase.de/forum/showthread.php?t=1051399
 
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post #532 of 690
Quote:
Originally Posted by elina08 View Post

Quote:
Originally Posted by kennyparker1337 View Post

Not quite sure what you said, but Intel has already officially stated the reason for higher temps is due to them not being able to get the voltage requirements (VID; stock voltage) down to where they expected.
Ivy Bridge is their first 22nm technology and would require much lower voltages than Sandy Bridge 32nm, due to a smaller die giving less heat transfer (surface).

Can you please give a link to this

Kinda yes. I guess, if you mean by officially, a press conference was held... then no.

But officially, as in common sense based on information released by Intel. The tri-gate transistor technology is what they used to get it to 22nm. But like I said previously... smaller more dense transistors = less voltage requirement. Obviously Intel did not want the temperatures on Ivy Bridge to be this high, at least comparable to Sandy Bridge. So one can infer that the voltage expectation for Ivy Bridge was not met by Intel.
post #533 of 690
What is the TCASE on these chips?
Not TMAX... thats 110 C... Anyone?
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post #534 of 690
Thread Starter 
Quote:
Originally Posted by opt33 View Post

I am ordering a UD5/i3770K on monday (or as soon as available) and already have calibrated probe/IR gun, so I can do it after things get here. I just hope some of heat issue isnt intel saving money on die attach, and not using solder, from the one person that delided theirs, but again dont know if person ran into solder or not yet.

Ok, thanks. I'll leave it to wild men like you tongue.gif I don't have the right knowledge to do this correct anyway, and the IR gun i have is not of the best quality. On another side, does anyone have experience with Post code 22 on a Max V Gene Board, i'm going over to a friends place to do LN2 later today but his board is acting up, have tried 2 chips and 10 different ram sticks in all slots, Clear CMOS, wont even make it into bios. We will use my board in case we wont get it up and running, but would be nice to "mend" it ^^

Thanks
post #535 of 690
Strange, can't find code 22 in the manual for the card. Have you checked slot for dust and hair?

Found this:

"Spoke with an Asus tech and remembered to ask what the post display error code 22 is. He replied it is a sought of ambiguous error that essentially means 'pre memory error.' What comes before the memory? The CPU ! It may indeed be the CPU that was causing the error. "


But it was an 1 year old post, i.e. not Gene V, but the codes doesn't change that often.. For example: IBM PC codes hasn't change for 20-25 years... since PC XT came out.

Thanks neighbor, for your great test!

//Lasse @ Sweden

Source: http://vip.asus.com/forum/view.aspx?id=20110328205809097&board_id=1&model=P8P67+DELUXE&SLanguage=en-us&page=2
Edited by Stingrayracing - 4/22/12 at 6:05am
post #536 of 690
There is no question majority of heat issue is from die shrink = higher power density, and new trigate tech, and likely things will get better with intels tweaking down the road with their new tech.

I just hope some (ie 8-10C) of the 25C hotter IVY vs Sandy at 1.4v, isnt from intel using cheaper die attach with much lower thermal conductance, vs their indium solder attach at 80 w/mk. But we will find out in time, as hot as these are, some will resort to delidding them. If mine overclocks poorly...
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post #537 of 690
Quote:
Originally Posted by opt33 View Post

There is no question majority of heat issue is from die shrink = higher power density, and new trigate tech, and likely things will get better with intels tweaking down the road with their new tech.
I just hope some (ie 8-10C) of the 25C hotter IVY vs Sandy at 1.4v, isnt from intel using cheaper die attach with much lower thermal conductance, vs their indium solder attach at 80 w/mk. But we will find out in time, as hot as these are, some will resort to delidding them. If mine overclocks poorly...

The issue is very likely due to the fact that the die is so small and that fact alone. I find it very unlikely that they are not soldered on and, if they are soldered on, delidding them would make the problem worse, since the IHS gives the far less conductive TIM a far greater surface area to transfer heat across. The only way delidding them would improve cooling would be if you were to attach the contact plate of your cooler to the die itself with solder; which I don't see as a very practical solution.

That's just my 2c though of course, based on what I know and understand of the problem.

EDIT: Even if they weren't soldered on, I don't think it would be possible to actually have these run without much bigger heat issues than are already present if it were using some kind of consumer grade TIM. I doubt that there would be anything that we as end users could do if it were due to some kind of issue between the IHS and the core. Just speaking from personal experience, I recently had a dud mount on my 2700K that saw 10c higher temps on 2 cores and 5c on the others because I didn't have enough TIM coverage. It sill had a decent amount on there though. I can only imagine that if I had just enough to cover there area of the die that it would be quite considerably worse. Moreso if it were just enough to cover an IB die!
Edited by DirektEffekt - 4/22/12 at 6:30am
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post #538 of 690
I agree, I said the same thing on the other forum when first posted, hard for me to believe they arent soldered, here is my post there im RGE

That being said, if intel did use non-solder attach, there will be people trying to get ahold of indium solder or other die attaches, and pop IHS, and giving it a whirl. 80 w/mk indium solder vs even 10 w/mk paste/attach between IHS and die would make a huge difference in core temps. Though granted an end use soldering as well as intel, not going to happen.

But for me, more of a curiosity now after that post on overclockers forum, because again, just have hard time believing they arent using solder, knowing power density increase from die shrink.
Edited by opt33 - 4/22/12 at 6:57am
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post #539 of 690
Ofcourse Intel uses solder...
No need to check that...
But what is with TCASE? Any news on that?
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post #540 of 690
Tcase is irrelevant unless you plan on embedding a thermocouple in IHS and running at stock settings, since Tcase is only provided for designing a cooling solution at stock settings, serves no other purpose, and Tcase spec is no longer even relevant for that once you alter the gradient from core to IHS by increasing voltage significantly above stock.

Intel core sensors, and keeping them at some defined distance from tjmax are all that matter.
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