Originally Posted by PCWargamer Denzo
, I do think you had a mounting problem at first, but I also think you are getting much better temps due to the delidding too. It is not uncommon for delidding to result in 20-30C improvements in temps if done correctly.
OCN does have an official delidding club for those who are interested:
At this club we have gathered info from many forums to attempt to find the best (safest and most effective) ways to delid the IB chips - and most people on that thread get a 20-30C drop in temps between their before and after temps (as measured using Real Temp running default IBT 10x run at 4.5GHz before and after delid).
The best TIM we have found is Coollaboratory Pro or Ultra, and we have also found that the IHS's are often concave or convex and temps can sometimes improve further from lapping them.
An interesting finding is that the IB temp problem is not mainly with Intel's TIM choice
, but instead due to the gap between the die and IHS caused by the black glue holding the IHS onto the PCB. Once the black glue and original TIM is removed the IHS will sit on the die - so that it can spin:
With the direct die to IHS contact, and the use of CL PRO or Ultra, most delidder’s get the 20-30C result. Seems with other TIMs we are only finding the 10-15C result common on many other forums, and sometimes it ends up being the convex or concave IHS that needs to be lapped after delidding.
My own results after delidding and lapping my IHS has been 27C (see my photo galleries under delidding for pics and before and after temp testing).
Thanks for the info. I did my homework and used Coollaboratory Liquid Pro between the chip and IHS, i also carefully polished the edges on the IHS to be perfectly flat using a mirror and ultra fine grit paper + water. Made sure all the black silicone was gone and i used some of that fine grit paper and water on the inside of the IHS to remove any trace of the stock TIM. (I dont know if i should have done that, risking further un-even surfaceing of the ihs`s inside. It was done with next to no force, paper barely touching the IHS. Just enough to get the surface clean and ready for Liquid Pro.)
I had intended on using Indigo Extreme between the IHS and waterblock, but after failing to POST the system after de-lidding, twice, i ran out of I.E... Turns out as i placed the chip back into its socket and carefully placed the ihs on top, i managed to snag a CPU pin in the top right corner between the edge of the cpu pcb and the socket wall, resulting in the loss of a cpu pin... which i ofcourse did not notice untill i had ordered a new CPU
So after a new motherboard arrived i re-applied Liquid Pro on the chip / backside of IHS, and used my backup TIM between IHS and Waterblock - Gelid Extreme.. and as of now, the results speak for themselfs, and i really dont think i would get any practical use of the Indigo Extreme as my radiator can pretty much keep my temps in the 40`s on the cpu and 30`s on my gpu`s no matter what i throw on them...