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[Various]Intel Ivy Bridge Reviews - Page 43

post #421 of 438
Quote:
Originally Posted by robwadeson View Post

Ivy bridge isn't very attractive pure-cpu-performance wise... except for its new Quicksync engine. Can anyone point to me which is still the better value 3770k or 2600k?

I would say the 3770k just because of the new chipset features and the fact that the 2600k will only be faster if you happen to get a golden chip that will do 5ghz. Otherwise your 4.6ghz Ivy is going to beat your 4.6-4.8ghz sandy.

Not only that but power consumption is way better and Lucid Virtu MVP looks like it might be a really cool addition for gamers.
    
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post #422 of 438
I was curious to see what sort of upgrade this was to me so I worked out Sysmark scores from AnandTech based on my previous overclocks, I also threw in a sandy bridge for comparison and this is what I got:


Conroe@2.8 200 (2006) tock
Bloomfield@3.6 281 (2008) tock
Sandy@5 402 (2011) tock
IB@4.8 415 (2012) tick


Not sure if IB@4.8 is fair though perhaps should be 5.
Edited by MaFi0s0 - 4/25/12 at 8:37pm
post #423 of 438
Quote:
Originally Posted by Blameless View Post

It will most certainly void the warranty, even the Performance Tuning Plan. You will have to physically cut the IHS off with a razor or sand all the way through it from above, either method can easily result in a dead CPU if you aren't fairly experienced and very careful.
I've delidded a half dozen CPUs (mostly A64s* and Opterons, but also an i7 920), damaging one (kocked off a few surface mount resistor when the razor slipped in too far, but the chip worked fine regardless), and indirectly killing another in the process (sanded through the i7 920 die and went too far, scratching it, which eventually turned into a crack that killed the chip a few weeks later as it spread). I've delidded a few NVIDIA GPUs as well, an 8800GTS (which I killed; probably broke some solder balls under the substrate with the strain), a GTX 260 and a GTX 285 ( both survived).
* mobile A64s were originally the same S754 as the desktop parts, so I started buying those to omit the heatspreader entirely, with much less work.

Based on your experience, is it an easy fix? It sounds like a very delicate procedure. I wonder if they'll release a revision without the shoddy IHS?
post #424 of 438
Quote:
Originally Posted by vikingsteve View Post

Based on your experience, is it an easy fix? It sounds like a very delicate procedure. I wonder if they'll release a revision without the shoddy IHS?

It's not "shoddy." The product performs within spec, and there's really no reason for intel to care about how their choice of TIM affects how well we can OC them.

As always, be careful what you wish for. Intel could say, "Ok, we'll fix it. All of our CPUs are now locked. Enjoy."
    
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post #425 of 438
Very true .intel could go and say ok guy due to termal issue we regret to inform you the k are no longer avail.you would still be stuck with the coolinh
g lol
post #426 of 438
Quote:
Originally Posted by Oedipus View Post

It's not "shoddy." The product performs within spec, and there's really no reason for intel to care about how their choice of TIM affects how well we can OC them.
As always, be careful what you wish for. Intel could say, "Ok, we'll fix it. All of our CPUs are now locked. Enjoy."

Hm. Well, the article I read made it sound shoddy. As if they cheaped out on it. It's just unfortunate.
post #427 of 438
I've removed a ton of IHS's and had only one incident with a bare die CPU. It was an old A-XP 1200 I believe. They didn't come with an IHS to begin with, as with all AMD chips at that time(and some Intel ones as well). I chipped off a small part of the edge of the die while trying to seat the HS. It lasted for about 3 days before it turned into a longer crack and finally died. This was back with the old style mounting systems for heatsinks that required you to put one side down first then the other to lock it. Creating an uneven pressure across the die until you had both ends clipped. With almost all modern HS's the mounting systems are much better, you wouldn't have that problem and would be much harder to mess up when mounting. Almost every problem that people had with CPU's without IHS's were cracking or chipping the die when mounting a heatsink back then. These days it should be much less a risk. Getting the IHS off is the more risky procedure now, but that is pretty trivial with the right tools and a steady hand.

I'm really interested to find out if the retail chips have the solder or the TIM used on the ES's. Either way, going bare die will still give a nice decrease in temps by removing it completely.
post #428 of 438
I am thinking that a 'golden' 2600k is better than ivy. I will be looking around for one now that the prices should come down a little.
post #429 of 438
Quote:
Originally Posted by tbris84 View Post

Quote:
Originally Posted by Blameless View Post

Better off just de-lidding the chip and running it with no IHS at all.
I thought Intel moved to copper with the Presscott, but it does appear that Northwood had copper interconnects as well.
So, it appears you are right, SNDS seems to more the result of an immature process than the materials involved.

I really want to know if this TIM over solder is just for the engineering test samples. I find it doubtful the engineering samples would be that different than the retail chip, but in the slight chance that the retail chips were soldered the whole "IB is too hot" argument would be rendered moot.

I don't think Intel would do that though, because you'd get insanely high temps in reviews and get the uproar that's been happening.
Quote:
Originally Posted by vikingsteve View Post

Quote:
Originally Posted by Blameless View Post

Better off just de-lidding the chip and running it with no IHS at all.
I thought Intel moved to copper with the Presscott, but it does appear that Northwood had copper interconnects as well.
So, it appears you are right, SNDS seems to more the result of an immature process than the materials involved.

So, if I wanted to, I could just use no IHS at all? That wouldn't affect the warranty? I've never taken apart a CPU before, so I'm just a bit wary of doing something wrong and voiding my warranty AND breaking my chip.

Warranty would be entirely gone, yes. But you have no need for an IHS at all. Intel/AMD only use them to prevent broken dies, laptop chips are actually nearly all IHSless.
Quote:
Originally Posted by vikingsteve View Post

Quote:
Originally Posted by Blameless View Post

It will most certainly void the warranty, even the Performance Tuning Plan. You will have to physically cut the IHS off with a razor or sand all the way through it from above, either method can easily result in a dead CPU if you aren't fairly experienced and very careful.
I've delidded a half dozen CPUs (mostly A64s* and Opterons, but also an i7 920), damaging one (kocked off a few surface mount resistor when the razor slipped in too far, but the chip worked fine regardless), and indirectly killing another in the process (sanded through the i7 920 die and went too far, scratching it, which eventually turned into a crack that killed the chip a few weeks later as it spread). I've delidded a few NVIDIA GPUs as well, an 8800GTS (which I killed; probably broke some solder balls under the substrate with the strain), a GTX 260 and a GTX 285 ( both survived).
* mobile A64s were originally the same S754 as the desktop parts, so I started buying those to omit the heatspreader entirely, with much less work.

Based on your experience, is it an easy fix? It sounds like a very delicate procedure. I wonder if they'll release a revision without the shoddy IHS?

It's fairly easy as long as you're very careful and take your time. I've done it to a few s775 CPUs.
    
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post #430 of 438
It would make sense that Intel would save the money and time to use tim knowing it would be more cost effective but also knowing that this new process may just be able to cope with higher temperatures. It would point towards the fact that 80-85c may be okay for IB.
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