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How thin is the protective metal sheat on the 2700k? Can it be lapped flat?

post #1 of 3
Thread Starter 
Having owned an overclocked Q6600 @ 3.5 for over four years, I never bothered with lapping the cpu, but now I would very much like to lap my new cpu, even if shaving off a single degree C if possible.

However, when I look at the very edge of the metal plate (around the bent part towards the base) on the 2700k, I am left with the impression that the thickness is nothing like the 1.2 mm I thought I read about somewhere.

Can the 2700k processor be lapped flat without breaking through the plating? Does anyone know?

Btw, an inspection of the 2700k I bought seem to show a slightly uneven surface, as if the platings started to slightly fold down around the core. Hardly noticable unless lying a flat piece of metal looking for the light to shine through the gaps, but prehaps room for improvement?

Edit: Typo, I wrote "sheat" where I should have written "sheet". Maybe "plating" would have been a better word for it.

The boxed version of the 2700k does not include any black protective piece of plastic like the OEM version of the Q6600. The protective cover for the Q6600 does not seem to fit the 2700k at the very center, but I fixed that by cutting out the center, and gluing (superglue) on a similar flat black piece of plastic for the cpu cocket to cover the hole. This cover now fits the 2700k, in case I should try lapping it.
Edited by Decoman - 4/24/12 at 3:31am
post #2 of 3
Thread Starter 
I suspect now that I might have forgotten something.

The tutorials I have seen of cpu lapping in general, show another layer of metal (copper?) beneath the upper one. So eh I guess that the purpose of the lapping infer the removal of the upper layer, so I realize now that my topic header just goes to show my ignorance here.

Am I correct in this? Is the metal sheet on the outer side of the cpu, to be expected to be sanded off completely? So my concern about the thickness is thus irrelevant?

Moderators are welcome to close this tread on their discretion if they judge this thread to be unhelpful or unclear.
Edited by Decoman - 4/24/12 at 3:53am
post #3 of 3
You mean the Integrated Heat Spreader (IHS). It is a nickel-coated copper with TIM between it and the CPU die and the IHS is epoxied to the packaging.

The point of lapping to make the surface of the IHS and HSF base flat so less TIM is needed.

Lapping the IHS completely off takes very very long time if done by hand.
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i7 920 [4.28GHz, HT] Asus P6T + Broadcom NetXtreme II VisionTek HD5850 [900/1200] + Galaxy GT240 2x4GB G.Skill Ripjaw X [1632 MHz] 
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